MacDermid Alpha Electronics Solutions High-Reliability Thermoplastic Adhesives for Microelectronics STAYSTIK ® 472

Description
Product Overview STAYSTIK 472 Thermoplastic Adhesive Film is designed for a variety of electronic applications, offering excellent bonding at low process temperatures and an exceptionally low elastic modulus of 60,000 psi. Its high compliance enables reliable bonding between materials with significantly different Thermal Expansion Coefficients (TCEs). The adhesive’s reworkable thermoplastic system provides key advantages in applications where traditional thermoset adhesives are less effective.
Request a Quote
Description
Product Overview STAYSTIK 472 Thermoplastic Adhesive Film is designed for a variety of electronic applications, offering excellent bonding at low process temperatures and an exceptionally low elastic modulus of 60,000 psi. Its high compliance enables reliable bonding between materials with significantly different Thermal Expansion Coefficients (TCEs). The adhesive’s reworkable thermoplastic system provides key advantages in applications where traditional thermoset adhesives are less effective.
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
High-Reliability Thermoplastic Adhesives for Microelectronics - STAYSTIK ® 472 - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
High-Reliability Thermoplastic Adhesives for Microelectronics
STAYSTIK ® 472
High-Reliability Thermoplastic Adhesives for Microelectronics STAYSTIK ® 472
Product Overview STAYSTIK 472 Thermoplastic Adhesive Film is designed for a variety of electronic applications, offering excellent bonding at low process temperatures and an exceptionally low elastic modulus of 60,000 psi. Its high compliance enables reliable bonding between materials with significantly different Thermal Expansion Coefficients (TCEs). The adhesive’s reworkable thermoplastic system provides key advantages in applications where traditional thermoset adhesives are less effective.

Product Overview

STAYSTIK 472 Thermoplastic Adhesive Film is designed for a variety of electronic applications, offering excellent bonding at low process temperatures and an exceptionally low elastic modulus of 60,000 psi.

Its high compliance enables reliable bonding between materials with significantly different Thermal Expansion Coefficients (TCEs). The adhesive’s reworkable thermoplastic system provides key advantages in applications where traditional thermoset adhesives are less effective.

Supplier's Site

Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Industrial Adhesives
Product Number STAYSTIK ® 472
Product Name High-Reliability Thermoplastic Adhesives for Microelectronics
Cure / Technology Thermoplastic / Hot Melt; Thermoset
Unlock Full Specs
to access all available technical data

Similar Products

Precision Camera Module Adhesive Solutions - ALPHA ® HiTech ® AD13-9521B - MacDermid Alpha Electronics Solutions
Specs
Cure / Technology Single Component
Type / Form Liquid
Features Thermally Conductive
View Details
Copper Adhesion Promoters for IC Substrates - MultiBond 500 - MacDermid Alpha Electronics Solutions
Specs
Substrate Compatibility Metal; Copper adhesion promotion
Industry Electronics; Semiconductors, IC's
View Details
High-Reliability Thermoplastic Adhesives for Microelectronics - STAYSTIK ® 181 - MacDermid Alpha Electronics Solutions
Specs
Cure / Technology Thermoplastic / Hot Melt; Thermoset
Composition Filled
Industry Electronics; Semiconductors, IC's
View Details
Advanced Hybrid Sintering Die Attach Solutions - ATROX ® 800HT7A - MacDermid Alpha Electronics Solutions
Specs
Features Electrically Conductive; Thermally Conductive
Industry Electronics; Semiconductors, IC's
View Details