Semiconductor wire and wedge bonders include tools for die bonding and wire bonding. Theyare used to attach and interconnect a semiconductor die or IC chip to a package or substrate. Die bonding tools include bonding capillaries, bonding wedges, EFO wands, die attach collets, die shear tools, ejector pins or push up needles, flip chip tools, spanking tools, push-up needles (pepperpots) and tab tools (microBGA, waffle).