DuPont Electronics & Imaging Datasheets for RF and Microwave Laminates
RF and microwave laminates are used as substrates for radio frequency (RF) and microwave communication systems and electronics. They are designed to meet the demanding performance standards for higher-frequency applications.
RF and Microwave Laminates: Learn more
| Product Name | Notes |
|---|---|
| Product Description DuPont™ Pyralux® GPL epoxy-based adhesive is part of our FPC total solution featuring low loss properties designed for high speed & high frequency applications in consumer electronics. With... | |
| DuPont™ Interra® embedded planar capacitor laminate is used to make thinner, more efficient power and ground planes within a multilayer printed wiring board. Interra® HK04J provides very low impedance at... | |
| DuPont™ Pyralux® AC is an all polyimide single sided copper clad laminate ideal for applications that require thin, light and high density circuitry along with chip-on-flex attachment. Features Excellent dimensional... | |
| DuPont™ Pyralux® AG is an all-polyimide double sided copper clad laminate that is offered in both sheets and rolls with global availability and is ideal for use in high volume... | |
| DuPont™ Pyralux® AP is an all polyimide double sided copper clad laminate that is the industry standard in terms of thermal, chemical and mechanical properties. It is ideal for use... | |
| DuPont™ Pyralux® APR is an all polyimide double sided resistor laminate ideal for advanced applications in military, aerospace, automotive and consumer electronics markets, where reliable embedded resistor technology, temperature tolerance,... | |
| DuPont™ Pyralux® FR products are acrylic-based flame retardant copper clad laminates, coverlays, bonpdplys and sheet adhesives for products requiring UL rating. Features: High bond strength High thermal resistance No refrigeration... | |
| DuPont™ Pyralux® HP is an epoxy-based adhesive system demonstrating both low loss and high reliability, specifically designed for OEMs and PCB design manufacturers. Its optimized low-loss solution is suitable for... | |
| DuPont™ Pyralux® HT bonding film can be used in conjunction with Pyralux® AP to create a complete all-polyimide flex laminate system that includes a double-sided, copper-clad laminate and a unique... | |
| DuPont™ Pyralux® HXC is DuPont™ Kapton® MBC black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired. It is coated on one side with... | |
| DuPont™ Pyralux® HXI is DuPont™ Kapton® black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired. It offers thinner construction than Pyralux® HXC, but... | |
| DuPont™ Pyralux® LF products are acrylic-based copper clad laminates, coverlays, bondplys and sheet adhesives and have been the industry standard in high reliability applications for over 35 years with a... | |
| DuPont™ Pyralux® LF-B is DuPont™ Kapton® B black polyimide film coated with acrylic ideal for products where uniform matte black appearance is desired. The coverlay is made with the leading... | |
| DuPont™ Pyralux® TA series are all polyimide copper clad laminates designed for high speed high frequency applications. They offer ideal balance between low loss performance, good bendability and easy processability. | |
| DuPont™ Pyralux® TK is a fluoropolymer/polyim ide composite double sided copper clad laminate and bondply ideal for high speed digital and high frequency flexible circuit applications. Specifically formulated with FEP... | |
| Interra® HK04M embedded capacitance laminate is used between the power and ground planes within a multilayer printed wiring board. Interra® HK04M provides very low impedance at high frequency, power bus... |