DuPont Electronics & Imaging All Polyimide Double Sided Copper Clad Laminate Pyralux® AP

Description
DuPont™ Pyralux® AP is an all polyimide double sided copper clad laminate that is the industry standard in terms of thermal, chemical and mechanical properties. It is ideal for use in rigid flex and multilayer flex applications which require advanced performance, such as low dissipation loss for high speed, high frequency, thermal resistance and high reliability. These clads provide designers and fabricators outstanding options in building circuits with high reliability and yield for controlled impedance and high-performance applications. Features: 30+ year track record of reliability and performance in the most demanding applications Low CTE for rigid flex multilayers Superior electrical performance and signal integrity (Dk = 3.4, Df = 0.002) Robust thermal resistance High tear and peel strengths Excellent dielectric thickness tolerance Low outgassing, NASA data available Halogen free Constructions: Available in polyimide thicknesses of 0.5, 1.0, 2.0, 3.0, 4.0, 5.0, and 6.0 mils; 7.0-20 mils available upon special request Available in copper thicknesses of 6, 9, 12, 18, 35, and 70 microns; thicker copper available upon special request Available in copper types RA, ED, and DT(RA) Custom sizes available in up to 85 inches in length Certifications: UL 94 V-0 flammability rating UL maximum operating temperature (MOT) 200°C Certified to IPC 4204A/11
Datasheet
Description
DuPont™ Pyralux® AP is an all polyimide double sided copper clad laminate that is the industry standard in terms of thermal, chemical and mechanical properties. It is ideal for use in rigid flex and multilayer flex applications which require advanced performance, such as low dissipation loss for high speed, high frequency, thermal resistance and high reliability. These clads provide designers and fabricators outstanding options in building circuits with high reliability and yield for controlled impedance and high-performance applications. Features: 30+ year track record of reliability and performance in the most demanding applications Low CTE for rigid flex multilayers Superior electrical performance and signal integrity (Dk = 3.4, Df = 0.002) Robust thermal resistance High tear and peel strengths Excellent dielectric thickness tolerance Low outgassing, NASA data available Halogen free Constructions: Available in polyimide thicknesses of 0.5, 1.0, 2.0, 3.0, 4.0, 5.0, and 6.0 mils; 7.0-20 mils available upon special request Available in copper thicknesses of 6, 9, 12, 18, 35, and 70 microns; thicker copper available upon special request Available in copper types RA, ED, and DT(RA) Custom sizes available in up to 85 inches in length Certifications: UL 94 V-0 flammability rating UL maximum operating temperature (MOT) 200°C Certified to IPC 4204A/11
Datasheet

Suppliers

Company
Product
Description
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All Polyimide Double Sided Copper Clad Laminate - Pyralux® AP - DuPont Electronics & Imaging
Research Triangle Park, NC, United States
All Polyimide Double Sided Copper Clad Laminate
Pyralux® AP
All Polyimide Double Sided Copper Clad Laminate Pyralux® AP
DuPont™ Pyralux® AP is an all polyimide double sided copper clad laminate that is the industry standard in terms of thermal, chemical and mechanical properties. It is ideal for use in rigid flex and multilayer flex applications which require advanced performance, such as low dissipation loss for high speed, high frequency, thermal resistance and high reliability. These clads provide designers and fabricators outstanding options in building circuits with high reliability and yield for controlled impedance and high-performance applications. Features: 30+ year track record of reliability and performance in the most demanding applications Low CTE for rigid flex multilayers Superior electrical performance and signal integrity (Dk = 3.4, Df = 0.002) Robust thermal resistance High tear and peel strengths Excellent dielectric thickness tolerance Low outgassing, NASA data available Halogen free Constructions: Available in polyimide thicknesses of 0.5, 1.0, 2.0, 3.0, 4.0, 5.0, and 6.0 mils; 7.0-20 mils available upon special request Available in copper thicknesses of 6, 9, 12, 18, 35, and 70 microns; thicker copper available upon special request Available in copper types RA, ED, and DT(RA) Custom sizes available in up to 85 inches in length Certifications: UL 94 V-0 flammability rating UL maximum operating temperature (MOT) 200°C Certified to IPC 4204A/11

DuPont™ Pyralux® AP is an all polyimide double sided copper clad laminate that is the industry standard in terms of thermal, chemical and mechanical properties. It is ideal for use in rigid flex and multilayer flex applications which require advanced performance, such as low dissipation loss for high speed, high frequency, thermal resistance and high reliability. These clads provide designers and fabricators outstanding options in building circuits with high reliability and yield for controlled impedance and high-performance applications.

Features:

  • 30+ year track record of reliability and performance in the most demanding applications
  • Low CTE for rigid flex multilayers
  • Superior electrical performance and signal integrity (Dk = 3.4, Df = 0.002)
  • Robust thermal resistance
  • High tear and peel strengths
  • Excellent dielectric thickness tolerance
  • Low outgassing, NASA data available
  • Halogen free

Constructions:

  • Available in polyimide thicknesses of 0.5, 1.0, 2.0, 3.0, 4.0, 5.0, and 6.0 mils; 7.0-20 mils available upon special request
  • Available in copper thicknesses of 6, 9, 12, 18, 35, and 70 microns; thicker copper available upon special request
  • Available in copper types RA, ED, and DT(RA)
  • Custom sizes available in up to 85 inches in length

Certifications:

  • UL 94 V-0 flammability rating
  • UL maximum operating temperature (MOT) 200°C
  • Certified to IPC 4204A/11
Supplier's Site Datasheet

Technical Specifications

  DuPont Electronics & Imaging
Product Category RF and Microwave Laminates
Product Number Pyralux® AP
Product Name All Polyimide Double Sided Copper Clad Laminate
Materials Polyimide (e.g., Kapton®); Plastic / Polymer
Application RF / Microwave
Features IPC; UL Listed
Thickness 0.0200 inches (0.5080 mm)
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