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DuPont Electronics & Imaging Datasheets for Industrial Adhesives

Industrial adhesives consist of hot melt adhesives, epoxy adhesives, polyurethane adhesives, sealants, thermoset adhesives, UV curing adhesives, silicon adhesives, acrylic adhesives and other related industrial products.
Industrial Adhesives: Learn more

Product Name Notes
Product Description DuPont™ Pyralux® GPL epoxy-based adhesive is part of our FPC total solution featuring low loss properties designed for high speed & high frequency applications in consumer electronics. With...
DuPont™ Pyralux® FR products are acrylic-based flame retardant copper clad laminates, coverlays, bonpdplys and sheet adhesives for products requiring UL rating. Features: High bond strength High thermal resistance No refrigeration...
DuPont™ Pyralux® HP is an epoxy-based adhesive system demonstrating both low loss and high reliability, specifically designed for OEMs and PCB design manufacturers. Its optimized low-loss solution is suitable for...
DuPont™ Pyralux® HT bonding film can be used in conjunction with Pyralux® AP to create a complete all-polyimide flex laminate system that includes a double-sided, copper-clad laminate and a unique...
DuPont™ Pyralux® HXC is DuPont™ Kapton® MBC black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired. It is coated on one side with...
DuPont™ Pyralux® HXI is DuPont™ Kapton® black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired. It offers thinner construction than Pyralux® HXC, but...
DuPont™ Pyralux® LF products are acrylic-based copper clad laminates, coverlays, bondplys and sheet adhesives and have been the industry standard in high reliability applications for over 35 years with a...
DuPont™ Pyralux® LF-B is DuPont™ Kapton® B black polyimide film coated with acrylic ideal for products where uniform matte black appearance is desired. The coverlay is made with the leading...
DuPont™ Pyralux® TK is a fluoropolymer/polyim ide composite double sided copper clad laminate and bondply ideal for high speed digital and high frequency flexible circuit applications. Specifically formulated with FEP...