3M Aerospace and Aircraft Maintenance Division 3M™ Scotch-Weld™ Structural Adhesive Film AF 500

Description
High bond strength from -67 to 300F (-55 to 149C). Minimum 45 days out-time at ambient temperatures. Controlled flow. Excellent composite bonding. Maintains good metal bonding performance. Composite co-cure adhesive with excellent peel.
Datasheet
Description
High bond strength from -67 to 300F (-55 to 149C). Minimum 45 days out-time at ambient temperatures. Controlled flow. Excellent composite bonding. Maintains good metal bonding performance. Composite co-cure adhesive with excellent peel.
Datasheet

Suppliers

Company
Product
Description
Supplier Links
St. Paul, MN, USA
3M™ Scotch-Weld™ Structural Adhesive Film
AF 500
3M™ Scotch-Weld™ Structural Adhesive Film AF 500
High bond strength from -67 to 300F (-55 to 149C). Minimum 45 days out-time at ambient temperatures. Controlled flow. Excellent composite bonding. Maintains good metal bonding performance. Composite co-cure adhesive with excellent peel.

High bond strength from -67 to 300F (-55 to 149C). Minimum 45 days out-time at ambient temperatures. Controlled flow. Excellent composite bonding. Maintains good metal bonding performance. Composite co-cure adhesive with excellent peel.

Supplier's Site Datasheet

Technical Specifications

  3M Aerospace and Aircraft Maintenance Division
Product Category Industrial Adhesives
Product Number AF 500
Product Name 3M™ Scotch-Weld™ Structural Adhesive Film
Cure / Technology Thermoset; Single Component
Chemical System Epoxy
Type / Form Sheet or Film
Unlock Full Specs
to access all available technical data

Similar Products

Nanosilica Filled, Optically Clear Epoxy Adhesive - EP113 - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  
Chemical System Epoxy
Composition Filled
View Details
Fluon® Perfluoro Adhesive - EA-2000 - AGC Chemicals Americas, Inc.
AGC Chemicals Americas, Inc.
Specs
Chemical System PFA
Type / Form Pellets
Features Laminaes
View Details
Light-Curable Materials, Dissimilar Substrate Bonding, 9-911-REV-B -  - Dymax
Specs
Cure / Technology UV or Radiation Cured
Type / Form Gel
Substrate Compatibility Dissimilar Substrates; Lead Frame; PCB
View Details
Ellsworth E-CAST 207-1 Epoxy Adhesive Light Gray 50 mL Cartridge - E-CAST 207-1 50ML CARTRDGE - Ellsworth Adhesives
Specs
Cure / Technology Two Component  
Chemical System Epoxy
Substrate Compatibility Metal; Paper or Paperboard; Plastic
View Details