3M Thermally Conductive Interface Pad; Insulator Body Material 3M 5590H-15

Description
THERMALLY CONDUCTIVE INTERFACE PAD; Insulator Body Material:Acrylic; Thermal Conductivity:3W/m.K; Breakdown Voltage Vbr:-; Thickness:1.5mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:33kV/mm RoHS Compliant: Yes
Datasheet
Description
THERMALLY CONDUCTIVE INTERFACE PAD; Insulator Body Material:Acrylic; Thermal Conductivity:3W/m.K; Breakdown Voltage Vbr:-; Thickness:1.5mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:33kV/mm RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermally Conductive Interface Pad; Insulator Body Material 3M - 41T5537 - Newark, An Avnet Company
Chicago, IL, United States
Thermally Conductive Interface Pad; Insulator Body Material 3M
41T5537
Thermally Conductive Interface Pad; Insulator Body Material 3M 41T5537
THERMALLY CONDUCTIVE INTERFACE PAD; Insulator Body Material:Acrylic; Thermal Conductivity:3W/m.K; Breakdown Voltage Vbr:-; Thickness:1.5mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:33kV/mm RoHS Compliant: Yes

THERMALLY CONDUCTIVE INTERFACE PAD; Insulator Body Material:Acrylic; Thermal Conductivity:3W/m.K; Breakdown Voltage Vbr:-; Thickness:1.5mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:33kV/mm RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 41T5537
Product Name Thermally Conductive Interface Pad; Insulator Body Material 3M
Thermal Conductivity 3 W/m-K (1.73 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

2-Part, Silicone Potting Compound and Encapsulant, UL Listed - QSil-563 - CHT USA Inc.
Specs
Cure / Technology Two Component  ; Addition
Industry Automotive; Electronics
Features Flame Retardant; UL Rating
View Details
Thin Film, Very High Thermal Conductivity - SARCON ® YR-a - Fujipoly® America Corp.
Specs
Form / Shape Gap Filler, Foam in Place Gasket
Gap Fill 0.0118 to 0.0335 inch (0.3000 to 0.8500 mm)
Industry Electronics; Semiconductors, IC's
View Details
Toughened One Part Epoxy for Chip Coating Applications - Supreme 3HTND-2CCM - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Glob Top, Daub, Doming or Overfill; Die Bonding Adhesives; Grease, Paste; Gap Filler, Foam in Place Gasket
View Details
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D - 745D - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details