MacDermid Alpha Electronics Solutions ATROX ® 800HT2VX

PFAS-free, conductive die attach products deliver a cost-effective, high-performance solution, leading the way in advanced materials. Product Overview A hybrid silver sintered die attach paste designed for high-power semiconductor packages with metallized dies. It features exceptional thermal conductivity, low resin bleed-out, and minimal condensable organics, ensuring outstanding package reliability in demanding applications such as automotive and 5G technology. This pressureless attachment solution supports high-temperature operations and enables high-volume manufacturing. Hybrid Silver Sintered Composition A hybrid silver sintered composition that delivers exceptional thermal conductivity, ensuring efficient heat dissipation. PFAS-Free Formulation PFAS-free, in compliance with environmental regulations, the elimination of per- and polyfluoroalkyl substances (PFAS) ensures safer handling and application.