Data Delay Devices, Inc. Datasheets for Delay Lines
Delay lines are devices used to slow down a signal by a time interval in an electrical network. There are two basic delay line technologies: passive and active.
Delay Lines: Learn more
Product Name | Notes |
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FEATURES • All-silicon, low-power CMOS technology • TTL/CMOS compatible inputs and outputs • Vapor phase, IR and wave solderable • Auto-insertable (DIP pkg.) • Low ground bounce noise • Leading-... | |
FEATURES • Digitally programmable in 128 delay steps • Monotonic delay-versus-address variation • Precise and stable delays • Input & outputs fully 10KH-ECL interfaced & buffered • Fits 48-pin DIP... | |
FEATURES • Digitally programmable in 16 delay steps • Monotonic delay-versus-address variation • Precise and stable delays • Input & outputs fully 100K-ECL interfaced & buffered • Available in 24-pin... | |
FEATURES • Digitally programmable in 64 delay steps • Monotonic delay-versus-address variation • Precise and stable delays • Input & outputs fully 10KH-ECL interfaced & buffered • Fits 48-pin DIP... | |
FEATURES • 10 taps of equal delay increment • Delays to 1000ns • Low profile • Epoxy encapsulated • Meets or exceeds MIL-D-23859C | |
FEATURES • 5 taps of equal delay increment • Delays to 200ns • Low profile • Epoxy encapsulated • Meets or exceeds MIL-D-23859C | |
FEATURES • All-silicon, low-power 3.3V CMOS technology • Vapor phase, IR and wave solderable • Auto-insertable (DIP pkg.) • Low ground bounce noise • Leading- and trailing-edge accuracy • Delay... | |
FEATURES • All-silicon, low-power 3.3V CMOS technology • Vapor phase, IR and wave solderable • Auto-insertable (DIP pkg.) • Low ground bounce noise • Leading- and trailing-edge accuracy • Increment... | |
FEATURES • All-silicon, low-power 5V CMOS technology • Vapor phase, IR and wave solderable • Auto-insertable (DIP pkg.) • Low ground bounce noise • Leading- and trailing-edge accuracy • Delay... | |
FEATURES • All-silicon, low-power CMOS technology • TTL/CMOS compatible inputs and outputs • Vapor phase, IR and wave solderable • Auto-insertable (DIP pkg.) • Low ground bounce noise • Leading-... | |
FEATURES • All-silicon, low-power CMOS technology • 3.3V CMOS compatible inputs and outputs • Vapor phase, IR and wave solderable • Auto-insertable (DIP pkg.) • Leading- and trailing-edge accuracy • | |
FEATURES • All-silicon, low-power CMOS technology • TTL/CMOS compatible inputs and outputs • Vapor phase, IR and wave solderable • Auto-insertable (DIP pkg.) • Leading- and trailing-edge accuracy • Programmable... | |
FEATURES • All-silicon, low-power CMOS technology • TTL/CMOS compatible inputs and outputs • Vapor phase, IR and wave solderable • Auto-insertable (DIP pkg.) • Low ground bounce noise • Leading-... | |
FEATURES • All-silicon, low-power CMOS technology • TTL/CMOS compatible inputs and outputs • Vapor phase, IR and wave solderable • Low ground bounce noise • Leading- and trailing-edge accuracy • | |
FEATURES • All-silicon, low-power CMOS technology • Vapor phase, IR and wave solderable • Low ground bounce noise • Leading- and trailing-edge accuracy • Delay range: 10 through 6000ns • | |
FEATURES • All-silicon, low-power CMOS technology* • TTL/CMOS compatible inputs and outputs • Vapor phase, IR and wave solderable • Auto-insertable (DIP package) • Low ground bounce noise • Leading-... | |
FEATURES • Digitally programmable in 256 delay steps • Monotonic delay-versus-address variation • Two separate outputs: inverting & non-inverting • Precise and stable delays • Input & outputs fully TTL... | |
FEATURES • Digitally programmable in 32 delay steps • Monotonic delay-versus-address variation • Precise and stable delays • Input & outputs fully 10KH-ECL interfaced & buffered • Fits 32-pin DIP... | |
FEATURES • Digitally programmable in 8 delay steps • Monotonic delay-versus-address variation • Precise and stable delays • Input & outputs fully 100K-ECL interfaced & buffered • Available in 16-pin... | |
FEATURES • Digitally programmable in 8 delay steps • Monotonic delay-versus-address variation • Two separate outputs: inverting & non-inverting • Precise and stable delays • Input & outputs fully TTL... | |
FEATURES • Eight equally spaced outputs • Fits in 400 mil 24-pin DIP socket • Input & outputs fully 100K-ECL interfaced & buffered | |
FEATURES • Five equally spaced outputs • Designed for surface mounting • Low profile (0.175 maximum height) • Input & outputs fully TTL interfaced & buffered • 10 T2L fan-out... | |
FEATURES • Five equally spaced outputs • Fits standard 14-pin DIP socket • Low profile • Auto-insertable • Input & outputs fully CMOS interfaced & buffered • 10 T2L fan-out... | |
FEATURES • Four indep’t programmable lines on a single chip • All-silicon CMOS technology • Low quiescent current (1mA typical) • Leading- and trailing-edge accuracy • Vapor phase, IR and... | |
FEATURES • Four indep’t programmable lines on a single chip • All-silicon CMOS technology • Low quiescent current (5mA typical) • Leading- and trailing-edge accuracy • Vapor phase, IR and... | |
FEATURES • Ideal for “Set and Forget” applications • Multi-turn adjustment screw (approx. 40 turns) • Input & output fully TTL interfaced & buffered (10 T2L fan-out capability) • Resolution:... | |
FEATURES • Ideal for “Set and Forget” applications • Multi-turn adjustment screw (1503: 40 turns, 1503J: 60 turns) • Stackable for PC board economy • 20mil x 10mil flat leads... | |
FEATURES • Ideal for “Set and Forget” applications • Multi-turn adjustment screw (1509: 20 turns, 1509J: 60 turns) • Stackable for PC board economy • Fits standard 14-pin DIP socket... | |
FEATURES • Microstrip Technology • Fast rise time for high frequency applications • Fixed delays available from 300ps to 6ns • Mechanically variable delay available (2075A) • I/O reversible • | |
FEATURES • Ten equally spaced outputs • Fits in 300 mil 32-pin DIP socket • Input & outputs fully 10KH-ECL interfaced & buffered | |
FEATURES • Varactor Technology • Fast rise time for high frequency applications • Delay continuously adjustable from 2.4ns to 3.4ns • Very narrow device (SIP package) • Stackable for PC... | |
FEATURES • All-silicon, low-power CMOS technology • TTL/CMOS compatible inputs and outputs • Vapor phase, IR and wave solderable • Auto-insertable (DIP pkg.) • Low ground bounce noise • Leading-... | |
FEATURES • Four indep’t programmable lines on a single chip • All-silicon CMOS technology • Low voltage operation (3.3V) • Low quiescent current (1mA typical) • Leading- and trailing-edge accuracy... | |
Features: Completely interfaced for TTL and DTL applications No external components required 10 taps equally spaced PC board space economy achieved | |
Features: Completely interfaced for TTL and DTL applications No external components required PC board space economy achieved Fits standard 14 pins DIP socket Operates over commercial temperature range | |
Features: Completely interfaced for TTL and DTL applications No external components required PC board space economy achieved Low profile Fits standard 14 pins DIP socket | |
Features: Completely interfaced with TTL & DTL applications No external components required PC board space economy achieved Fits standard 14 pins DIP socket | |
FEATURES: Input & output TTL buffered 4-Bit TTL programmable delay line Two separate outputs; inverting & non-inverting Completely interfaced Compact & low profile | |
FEATURES • Ideal for “Set and Forget” applications • Multi-turn adjustment screw (1503: 40 turns, 1503J: 60 turns) • Stackable for PC board economy • 20mil x 10mil flat leads... | |
FEATURES · 10 taps of equal delay increment · Delays as large as 300ns available · Low DC resistance · Standard 14-pin DIP package · Epoxy encapsulated · Meets or... | |
FEATURES · 10 taps of equal delay increment · Very narrow device (SIP package) · Stackable for PC board economy · Low profile · Epoxy encapsulated · Meets or exceeds... | |
FEATURES · 20 taps of equal delay increment · High bandwidth (TD/TR =10) · Low profile · Epoxy encapsulated · Meets or exceeds MIL-D-23859C | |
FEATURES · 5 taps of equal delay increment · Delays to 200ns · Low profile · Epoxy encapsulated · Meets or exceeds MIL-D-23859C | |
FEATURES · 5 taps of equal delay increment · Very narrow device (SIP package) · Stackable for PC board economy · Low profile · Epoxy encapsulated · Meets or exceeds... | |
FEATURES · 5 taps of equal delay increment · Delays as large as 300ns available · Low DC resistance · Standard 14-pin DIP package · Epoxy encapsulated · Meets or... | |
FEATURES · Digitally programmable in 128 delay steps · Monotonic delay-versus-address variation · Two separate outputs: inverting & non-inverting · Precise and stable delays · Input & outputs fully TTL... | |
FEATURES · Digitally programmable in 16 delay steps · Monotonic delay-versus-address variation · Two separate outputs: inverting & non-inverting · Precise and stable delays · Input & outputs fully TTL... | |
FEATURES · Digitally programmable in 32 delay steps · Monotonic delay-versus-address variation · Two separate outputs: inverting & non-inverting · Precise and stable delays · Input & outputs fully TTL... | |
FEATURES · Digitally programmable in 64 delay steps · Monotonic delay-versus-address variation · Two separate outputs: inverting & non-inverting · Precise and stable delays · Input & outputs fully TTL... | |
FEATURES · Digitally programmable in 8 delay steps · Monotonic delay-versus-address variation · Precise and stable delays · Input & outputs fully 10KH-ECL interfaced & buffered · Fits standard 16-pin... | |
FEATURES · Digitally programmable in 8 delay steps · Monotonic delay-versus-address variation · Precise and stable delays · Input & outputs fully TTL interfaced & buffered · 10 T2L fan-out... | |
FEATURES · Fast rise time for high freq. applications · Very narrow device (SIP package) · Stackable for PC board economy · Low profile · Epoxy encapsulated · Meets or... | |
FEATURES · Fast rise time for high frequency applications · Very narrow device (SIP package) · Stackable for PC board economy · Low profile · Epoxy encapsulated · Meets or... | |
FEATURES · Fast rise time for high frequency applications · Delays as large as 1000ns available · Low DC resistance · Standard 16-pin DIP package · Epoxy encapsulated · Meets... | |
FEATURES · Five equally spaced outputs · Designed for surface mounting · Low profile (0.175 maximum height) · Input & outputs fully CMOS interfaced & buffered · 10 T2L fan-out... | |
FEATURES · Five equally spaced outputs · Fits standard 14-pin DIP socket · Low profile · Auto-insertable · Input & outputs fully TTL interfaced & buffered · 10 T2L fan-out... | |
FEATURES · Five equally spaced outputs · Fits standard 16-pin DIP socket · Auto-insertable · Input & outputs fully 10KH-ECL interfaced & buffered | |
FEATURES · Five equally spaced outputs · Fits standard 8-pin DIP socket · Low profile · Auto-insertable · Input & outputs fully CMOS interfaced & buffered · 10 T2L fan-out... | |
FEATURES · Five equally spaced outputs · Fits standard 8-pin DIP socket · Low profile · Auto-insertable · Input & outputs fully TTL interfaced & buffered · 10 T2L fan-out... | |
FEATURES · Five equally spaced outputs · Very narrow device (SIP package) · Stackable for PC board economy · Input & outputs fully CMOS interfaced & buffered · 10 T2L... | |
FEATURES · Five equally spaced outputs · Very narrow device (SIP package) · Stackable for PC board economy · Input & outputs fully TTL interfaced & buffered · 10 T2L... | |
FEATURES · Five equally spaced outputs · Fits standard 8-pin DIP socket · Low profile · Auto-insertable · Input & outputs fully CMOS interfaced & buffered · 10 T2L fan-out... | |
FEATURES · Four independent delay lines · Fits 24-pin (400mil) DIP socket · Auto-insertable · Input & outputs fully 100K-ECL interfaced & buffered | |
FEATURES · High bandwidth (TD/TR =10) · Low profile · Epoxy encapsulated · Meets or exceeds MIL-D-23859C | |
FEATURES · Ideal for “Set and Forget” applications · Multi-turn adjustment screw (approx. 15 turns) · Fits standard 16-pin DIP socket · Input & output fully TTL interfaced & buffered... | |
FEATURES · Ideal for “Set and Forget” applications · Multi-turn adjustment screw (approx. 15 turns) · Surface-mount package · Input & output fully TTL interfaced & buffered (10 T2L fan-out... | |
FEATURES · Microstrip Technology · Fast rise time for high frequency applications · Delay available from 100ps to 2500ps · Very narrow device (SIP package) · Stackable for PC board... | |
FEATURES · Ten equally spaced outputs · Fits standard 14-pin DIP socket · Low profile · Auto-insertable · Input & outputs fully TTL interfaced & buffered · 10 T2L fan-out... | |
FEATURES · Ten equally spaced outputs · Fits standard 16-pin DIP socket · Low profile · Auto-insertable · Input & outputs fully CMOS interfaced & buffered · 10 T2L fan-out... | |
FEATURES · Ten equally spaced outputs · Very narrow device (SIP package) · Stackable for PC board economy · Input & outputs fully TTL interfaced & buffered · 10 T2L... | |
FEATURES · Three independent delay lines · Fits standard 14-pin DIP socket · Low profile · Auto-insertable · Input & outputs fully CMOS interfaced & buffered · 10 T2L fan-out... | |
FEATURES · Three independent delay lines · Fits standard 16-pin DIP socket · Auto-insertable · Input & outputs fully 10KH-ECL interfaced & buffered | |
FEATURES · Two independent delay lines · Fits standard 16-pin DIP socket · Auto-insertable · Input & outputs fully 10KH-ECL interfaced & buffered | |
FEATURES · Two independent delay lines · Fits standard 8-pin DIP socket · Low profile · Auto-insertable · Input & outputs fully CMOS interfaced & buffered · 10 T2L fan-out... | |
Features Auto-insertable. Completely interfaced for TTL & DTL application PC board space economy achieved Fits standard 14 pins DIP socket 3 equal delay units/package | |
Features Completely interfaced for TTL & DTL application PC board space economy achieved Fits standard 14 pins DIP socket 2 equal delay units/package | |
Features Completely interfaced for TTL & DTL application PC board space economy achieved Fits standard 14 pins DIP socket 4 equal delay units/package | |
Features High operating frequency (100 MHz). Very low ground bounce noise. Voltage & temperature compensated. Auto-insertable. TTL/CMOS compatible, low power CMOS. Vapor phase, IR and wave solderable. | |
FEATURES · Digitally programmable in 16 delay steps · Monotonic delay-versus-address variation · Precise and stable delays · Input & outputs fully 10KH-ECL interfaced & buffered · Fits 32-pin DIP... | |
Mechanically variable LSTTL delay line |