| Product Name |
Notes |
| Optical -- OE107M | A clear, flexible epoxy used for low stress adhesive and potting applications. |
| UV -- OG172 | A low index of refraction, optical grade adhesive for fiber packaging, sensor device, and general opto-electronic assemblies. It is a higher viscosity alternative to EPO-TEK® OG134. |
| General -- B9021-1, General -- B9021-1 Black, General -- B9021-6 | A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate attach. For opto-packaging, it can be used... |
| General -- M10-D | A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate attach. In opto-packaging, it can be used... |
| Optical -- MA-5 | A single component, B-stageable, optical grade epoxy for fiber optic assembly. It may be used for B-stage sealing of fiber cables into ferrules, or fiber optic feed-through into the opto-package. |
| General -- B9101-2 Unfilled | A single component, electrically and thermally insulating epoxy designed for adhesive, sealing and potting of micro-electronics and semiconductor devices. It can be used in many industries such as military, automotive,... |
| Electrical -- ED1003 | A single component, electrically conductive adhesive designed for high power LED die attach applications. Its combination of high thermal conductivity, shiny silver appearance and low outgassing are ideal for the... |
| Electrical -- E3037 | A single component, electrically conductive, thixotropic silver-filled epoxy for die-attach and SMD-attach inside hybrid microelectronics. |
| Thermal -- TZ101 | A single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics. It can be used as an underfill for flip chip mounted ICs,... |
| Thermal -- H63 | A single component, electrically insulating, thermally conductive epoxy adhesive for semiconductor, hybrid packaging and electronic circuit assembly applications. It is a higher viscosity alternative to EPO-TEK® H62. |
| General -- H61 Unfilled | A single component, high Tg, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications. It is a liquid version of EPO-TEK® H61. |
| Thermal -- H61LV | A single component, high Tg, thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications. It is a lower viscosity version of EPO-TEK® H61. |
| Thermal -- H61ND | A single component, high Tg, thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications. |
| Thermal -- T6065 | A single component, high Tg, thermally conductive, semiconductor die-attach grade epoxy. It was designed for bonding chips and SMD's inside hybrid micro-electronic packages. Other applications include JEDEC and opto-electronic packaging. |
| UV -- OG159-2 | A single component, high viscosity, UV curable epoxy adhesive designed for sealing glass plates together in the LCD/OLED/display industry. It contains 1mil glass beads for bond line control. Common applications... |
| UV -- OG603 | A single component, low viscosity, UV curable adhesive designed for curing in seconds. It is an all-purpose, general adhesive for optical applications including fiber optic components, DVD, medical, and PCB... |
| Electrical -- P10 | A single component, modified polyimide, high-temperature grade, silver-filled, electrically and thermally conductive adhesive designed for semiconductor die attach and hybrid microelectronic packaging. |
| Electrical -- P1011S | A single component, modified polyimide, high-temperature grade, silver-filled, electrically and thermally conductive adhesive designed for semiconductor die-attach and hybrid microelectronic packaging. It is a lower viscosity version of EPO-TEK® P1011... |
| UV -- OG125 | A single component, optically clear, low index of refraction, UV curable epoxy adhesive for fiber optic and opto-electronic device packaging. |
| UV -- OG147, UV -- OG147-7 | A single component, optically opaque, UV curable epoxy, designed for adhesive, sealing, and encapsulating applications found in semiconductor, electro-optics, fiber optics, circuit assembly, medical, and scientific/OEM industries. It is a... |
| UV -- OG114-4 | A single component, optically transparent, UV curable adhesive for opto-electronic applications including fiber packaging, LCD, LEDs, sensor devices, SCI-OEM precision optics and general electronic assembly. It is non-yellowing after cure... |
| Electrical -- H37-MPT | A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding SMDs for hybrid microelectronic packaging. It is certified and lot accepted to the requirements of... |
| Electrical -- ED1020 | A single component, silver-filled epoxy designed for low power semiconductor LED die attach applications. Its unique features include excellent adhesion and stress relief through mechanical reliability testing. Other attributes include... |
| Electrical -- ED1021 | A single component, silver-filled epoxy designed for low power semiconductor LED die attach applications. Unique features include its ability to achieve high thermal conductivity values at low cure temperatures and... |
| Electrical -- EM127 | A single component, silver-filled epoxy, designed especially for semiconductor LED die attach. It has a shiny silver, metallic looking appearance which aids in the LED overall brightness. Some other features... |
| Electrical -- EE149-6 | A single component, silver-filled, B-stageable epoxy designed for semiconductor flip chip packaging or hybrid micro-electronic substrate attach or lid-sealing. |
| Electrical -- E3084 | A single component, silver-filled, electrically and thermally conductive adhesive designed for semiconductor die-attach and hybrid microelectronics packaging applications found in military, medical, industrial and aerospace industries. |
| General -- 390-1, Optical -- 390, Optical -- OE132 | A single component, solvent containing, low viscosity polyimide designed for high temperature applications found in semiconductor, hybrid, optical, and medical devices. It is used mostly as a coating and dielectric... |
| General -- T3084-A2A | A single component, solvent free, screen printable polymer designed for semiconductor wafer applications including passivation, CSP, MEMs and alpha particle protection of memory die. Its unique features include sharp printing... |
| Electrical -- B9126-8 | A single component, thermally and electrically conductive, epoxy adhesive designed for semiconductor die attach and circuit assembly applications. Its unique features are a one month pot-life, low temperature cure, and... |
| Electrical -- E3035 | A single component, thermally and electrically conductive, semiconductor die attach grade epoxy. It was designed for bonding chips and SMD's inside hybrid micro-electronic packages. Other applications include JEDEC and opto-electronic... |
| Thermal -- H67-MP, Thermal -- T6067 | A single component, thermally conductive and electrically insulating epoxy designed for semiconductor die attach and bonding of SMDs for hybrid microelectronic packaging. It can be used for heat sinking, solder... |
| Thermal -- TM112 | A single component, thermally conductive and electrically insulating epoxy-adhesive. It was designed for high temperature hybrid micro-electronic packaging. It may be used for die attach, heat sinking, or ceramic substrate... |
| Thermal -- B9126-7 | A single component, thermally conductive, electrically insulating epoxy adhesive designed for semiconductor die attach and circuit assembly applications. Its unique features are a low temperature cure and syringe dispensing rheology. |
| Thermal -- T6067-T | A single component, thermally conductive, electrically insulating epoxy designed for hybrid microelectronic packaging and assemblies. It may be used for bonding SMDs, die-attach, substrate-attach or general heat sinking. |
| Thermal -- H67MP-GB | A single component, thermally conductive, electrically insulating epoxy designed to meet the requirements of MIL-STD-883/Test Method 5011 for hybrid microelectronic packaging and assemblies. It maybe used for bonding SMDs, die-attach,... |
| Thermal -- B9021-13 | A single component, thermally conductive, electrically insulating, B-stageable epoxy paste. It was designed for heat sinking applications found at the semiconductor and PCB level electronics packaging. It may also be... |
| General -- GE116, General -- GE120 | A single component, thixotropic, electrically and thermally insulating epoxy adhesive designed for bonding SMDs to the PCB. It can be used for electronic assembly in many devices including consumer electronics,... |
| UV -- OG142 | A single component, UV curable epoxy, designed for adhesive, sealing, and encapsulating applications found in semiconductor, electro-optics, fiber optics, medical, and scientific/OEM industries. It is a high Tg epoxy, ideal... |
| UV -- OG115 | A single component, UV curable epoxy, designed for adhesive, sealing, and encapsulating applications found in semiconductor, electro-optics, fiber optics, medical, and scientific/OEM industries. It is an ideal all-purpose adhesive. |
| UV -- OG116 | A single component, UV cured, high viscosity adhesive for opto-electronic applications including fiber optic packaging, sensor device, SCI-OEM optics and general electronic assembly. Notable qualities include high Tg and index... |
| UV -- OG142-6 | A single component, UV cured, thixotropic adhesive for semiconductor, PCB and opto-electronic assembly. Due to its paste like rhelogy, it may be screen printed or dispensed, and is suggested for... |
| UV -- OG178 | A single component, UV/visible shifted light curable epoxy, designed for adhesive, sealing, coating and encapsulating applications found in semiconductor, electro-optics, fiber optics, medical, and scientific/OEM industries. It is a low... |
| Optical -- 383ND | A slightly longer pot life version of EPO-TEK® 353ND |
| Optical -- OE101 | A two component epoxy designed for low stress applications in fiber optic packaging, opto-electronics and semiconductors. It is a lower modulus version of EPO-TEK® 353ND. |
| Optical -- OE138 | A two component epoxy with intermediate viscosity range between
EPO-TEK®353ND and EPO-TEK® 353ND-T. It is designed for semiconductor glob top applications, as well as use in medical and fiber optic... |
| Optical -- 320NC-2 | A two component, black colored and optically opaque epoxy designed for optical, medical, and opto-electronic packaging of semiconductor devices and components. It is a modification of EPO-TEK® 320 for increased... |
| Optical -- 320-3 | A two component, black-colored and optically opaque epoxy designed for optical, medical, and opto-electronic packaging of semiconductor devices and components. It is a modification of EPO-TEK® 320 for increased electrical... |
| Optical -- 320NC | A two component, black-colored and optically opaque epoxy designed for optical, medical, and opto-electronic packaging of semiconductor devices and components. It is a modification of EPO-TEK® 320 for increased insulation... |
| Electrical -- 430, Electrical -- 431 | A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding. Fast... |
| Optical -- 310T-M | A two component, flexible epoxy designed for low stress applications in semiconductor, hybrid, medical, acoustical and optical industries. Replacement for EPO-TEK® 310T. |
| Optical -- 310M | A two component, flexible, optically clear epoxy adhesive designed for optical, semiconductor, and medical applications. |
| Optical -- 375 | A two component, heat curing epoxy designed for high temperature fiber optic and medical applications. USP Class VI approved. |
| Optical -- 314 | A two component, high temperature grade, thermally and electrically insulating epoxy, designed for adhesive and sealing applications found in semiconductor, electro-optics, fiber optics, medical, and scientific/OEM industries. It is a... |
| Optical -- 353ND-T4 | A two component, high temperature, thixotropic epoxy designed for high temperature applications in fiber optics, electronics and medical devices. |
| Optical -- 353ND-T BLACK | A two component, high temperature, thixotropic epoxy for fiber optic, medical and PCB applications. It can be used for applications needing non-flow due to capillary action or gravity, as well... |
| Thermal -- 920, Thermal -- 921, Thermal -- 921-FL | A two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive for... |
| Optical -- OE100T | A two component, high Tg, high temperature grade epoxy designed for semiconductor, underfill, hard-disk drive and hybrid micro-electronics packaging applications. The epoxy can also be used for adhesive and sealing... |
| Optical -- OH105 | A two component, high Tg, low viscosity, optically opaque epoxy designed for packaging of fiber optics and opto-electronics. It can be used as an adhesive, seal or encapsulant for many... |
| Thermal -- H73, Thermal -- H74 | A two component, high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. A higher viscosity alternative to EPO-TEK® H74. NASA... |
| Thermal -- H75 | A two component, high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. It may be considered a higher viscosity alternative... |
| Thermal -- H74F | A two component, high Tg, thermally conductive, electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies. It may be used for flip chip underfill,... |
| Optical -- OH105-T | A two component, high Tg, thixotropic, optically opaque epoxy designed for packaging of fiber optics and opto-electronics. It can be used as an adhesive, seal or encapsulant for many types... |
| Optical -- OE120 | A two component, opaque epoxy, designed for fiber optics packaging applications. It is a black-colored version of EPO-TEK 353ND-T. It has a high Tg for resisting elevated operating temperatures found... |
| Optical -- 320LV | A two component, optically opaque epoxy adhesive designed for semiconductor and PCB applications in optoelectronic instrumentation and assemblies. A lower viscosity version of EPO-TEK® 320 that can be poured, potted... |
| Optical -- OM125 | A two component, room temperature curing fiber optic grade epoxy. It was designed for Telecordia 1221 applications of fiber optics and is also ideal for eliminating cracking of the glass... |
| General -- 730 Unfilled Black | A two component, room temperature curing, general and structural grade epoxy. It can be used for adhesive, sealing, and encapsulating applications in medical, x-ray device, filtration, opto-electronics, and PCB industries. |
| Optical -- 301-1 | A two component, room temperature curing, optical grade epoxy, designed for optics, medical, and opto-electronic packaging of semiconductor devices, components, and electronics. It is a lower viscosity version of EPO-TEK® |
| General -- 730 Unfilled | A two component, room temperature-curing, thermally and electrically insulating epoxy. It can be used for adhesive, sealing, potting or encapsulation applications found in semiconductor, electronics, optical and medical devices. |
| Electrical -- E2116-5 | A two component, silver-filled and stencil printable electrically conductive adhesive for bonding SMDs onto PCB and substrates. Can be used as a "lead-free" alternative in circuit assembly applications found in... |
| Electrical -- EH100 | A two component, silver-filled epoxy designed for ITO interconnects in LCD packaging and assembly. It is a 3 mil glass-beaded version of EPO-TEK® E4110. It may also be used for... |
| Electrical -- E4110-PFC | A two component, silver-filled thixotropic epoxy for fine pitch applications in semiconductor flip chip or SMD microelectronic assemblies. Screen-printed "bumps" of EPO-TEK® E4110-PFC can be the size of 80 µm... |
| Electrical -- H20E-HC | A two component, silver-filled, electrically and thermally conductive epoxy, designed for semiconductor die-attach and hybrid microelectronic packaging. It can be used for heat sinking, plastic IC packaging in JEDEC format,... |
| Electrical -- H21 | A two component, silver-filled, electrically conductive epoxy designed for hybrid micro-electronic packaging and assemblies. It can be used for die-attach or SMD attach onto ceramic substrates as well as package... |
| Electrical -- EE165-3 | A two component, silver-filled, electrically conductive epoxy made for bonding of SMDs, and general solder replacement at the PCB level and circuit assembly. It was designed to be low modulus... |
| Electrical -- E2036 | A two component, slightly flexible, silver-filled, electrically conductive adhesive for semiconductor and electronic assemblies. It is a low Tg epoxy, intended for many kinds of electronics at the PCB level,... |
| Thermal -- H70E-1 | A two component, thermally conductive, electrically insulating epoxy adhesive designed for semiconductor and microelectronic packaging. It is most commonly used for die-attach and heat sinking applications. |
| Thermal -- H70E-2LC | A two component, thermally conductive, electrically insulating epoxy designed for glob-top chip protection in TAB and COB die-attach technologies. It is used to prevent chips from being mechanically damaged during... |
| Thermal -- H77S | A two component, thermally conductive, electrically insulating high-temperature epoxy adhesive. It can be used for high temperature applications within semiconductor packaging including glob top and underfill, hybrid microelectronics, optical, and... |
| Thermal -- H77T | A two component, thermally conductive, electrically insulating high-temperature epoxy adhesive. It can be used for high temperature applications within semiconductor packaging, hybrid microelectronics, optical, and medical. It is a more... |
| Optical -- 353ND-T1 | A two component, thixotropic and high temperature epoxy designed for fiber optic, electronics and medical applications. It is a more viscous alternative to EPO-TEK® 353ND-T. |
| Optical -- 353ND-T3 | A two component, thixotropic and high temperature epoxy designed for fiber optic, electronics and medical applications. |
| Thermal -- H55 | A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications. |
| Optical -- 354-T | A two component, thixotropic, high Tg epoxy designed for semiconductor packaging in medical, fiber optic and optoelectronic assemblies. It is an electrically and thermally insulating epoxy and a more thixotropic... |
| General -- 731 | A two component, thixotropic, room temperature-curing epoxy adhesive. It is an electrically and thermally insulating epoxy designed for general applications in semiconductor packaging, electronics, medical, and optical industries. A higher... |
| Thermal -- 930-1 | A two part, thermally conductive, electrically insulating epoxy. It can be used for heat sinking semiconductor devices, hybrid microelectronics, optics or medical devices. It is a lower viscosity and smaller... |
| Thermal -- 930 | A two-part thermally conductive epoxy for heat sinking electronics and hybrids. It can be used at the PCB level for circuit assembly. |
| Optical -- 353ND-T5 | An intermediate viscosity version of EPO-TEK® 353ND and EPO-TEK® 353ND-T It was designed for high temperature applications in fiber optics, electronics and medical devices. |
| Electrical -- EV2002 | Electrical type, electrical conductivity, oven cure method |
| Electrical -- E2116-4, Electrical -- E3001-R2 | electrical |
| Optical -- 353ND BLACK | EPO TEK® 353ND Black is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. |
| Optical -- 353ND-T | EPO TEK® 353ND-T is a two component, highly thixotropic epoxy with non-flowing properties and high temperature resistance. |
| Optical -- 377 | EPO TEK® 377 is a two component, high Tg, fiber optic grade epoxy adhesive. It is well suited for semiconductor, medical and optical applications. |
| Electrical -- H20E-LC | EPO TEK® H20E-LC is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due... |
| Electrical -- H20S | EPO-TEK H20S is a modified version of EPO-TEK H20E, designed primarily for die stamping and dispensing techniques for chip bonding. EPO-TEK® H20S is a highly reliable, two component, silver-filled epoxy... |
| Optical -- OH101 | EPO-TEK OH101 is a two component epoxy that can be cured with or without heat. In addition to its excellent optical properties, the OH101 is a clear epoxy that has... |
| Optical -- 301-2 | EPO-TEK® 301-2 is a two component optical, medical, and semiconductor grade epoxy resin, with low viscosity, long pot-life, and good handling characteristics. |
| Optical -- 301-2FL | EPO-TEK® 301-2FL is a two component optical, medical, and semiconductor grade epoxy resin. It is a more flexible version of EPO-TEK® 301-2. |
| Optical -- 305 | EPO-TEK® 305 is a two component, semi-rigid, optical grade epoxy for semiconductor packaging of fiber optics, optoelectronics and medical devices. It is an electrically and thermally insulating epoxy. |
| Optical -- 320 | EPO-TEK® 320 is a two component, black-colored and optically opaque epoxy designed for optical, medical, and opto-electronic packaging of semiconductor devices and components. It is a widely used fiber-optic grade... |
| Optical -- 330 | EPO-TEK® 330 is a two component, high-temperature grade, electrically and thermally insulating epoxy for semiconductor, electronics, fiber optics and medical applications. |
| Optical -- 353ND | EPO-TEK® 353ND is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. It is one of the most popular EPO-TEK® brand products, and is... |
| Optical -- 353ND-4 | EPO-TEK® 353ND-4 is a two component, high Tg epoxy designed for fiber optic applications, medical, and hybrid packaging. |
| Optical -- 354 | EPO-TEK® 354 is a two component, high Tg epoxy designed for semiconductor packaging in medical, fiber optic and optoelectronic assemblies. It is an electrically and thermally insulating epoxy. |
| General -- 360 | EPO-TEK® 360 is a two component, high-temperature grade epoxy for semiconductor, electronics, fiber optics and medical applications. |
| Electrical -- 377H | EPO-TEK® 377H is a two component, high Tg, graphite filled epoxy designed for ESD/EMI shielding of semiconductor devices and electronics. It can be used in many electronic industries like consumer,... |
| General -- 509FM-1 | EPO-TEK® 509FM-1 is a two component, optically opaque epoxy designed for potting of semiconductors, PCB and systems-level electronics. It can be used in many electronic industries such as consumer, military,... |
| General -- 730 | EPO-TEK® 730 is a two component, thixotropic, room temperature-curing epoxy adhesive. |
| Thermal -- 920-FL | EPO-TEK® 920-FL is a two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It is a... |
| Thermal -- 930-4 | EPO-TEK® 930-4 is a two component, thermally conductive epoxy, formulated with a very fine boron-nitride filler particle. Also available in a single component frozen syringe. |
| Thermal -- B9073-4 | EPO-TEK® B9073-4 is a single component, thermally conductive, B-stageable epoxy, designed for hybrid micro-electronic assemblies. |
| Optical -- CF6-2 | EPO-TEK® CF6-2 is a two component, high temperature and high Tg epoxy designed for fiber optic packaging. |
| Electrical -- E2116 | EPO-TEK® E2116 is a two component, silver-filled and stencil printable electrically conductive adhesive for bonding SMDs onto PCB and substrates. Can be used as a "lead-free" alternative in circuit assembly... |
| Electrical -- E3035T-2 | EPO-TEK® E3035T-2 is a single component, silver-filled epoxy for semiconductor die attach, as well as SMD attach on hybrid circuits. |
| Electrical -- E3081 | EPO-TEK® E3081 is a single component, high temperature grade, silver-filled, electrically and thermally conductive adhesive designed for semiconductor die-attach and hybrid microelectronics packaging applications found in military, medical, industrial and... |
| Electrical -- E3082 | EPO-TEK® E3082 is a single component, silver filled, electrically and thermally conductive adhesive for semiconductor die attach, hybrid, electronics and optical applications. It is a one component version of EPO-TEK® |
| Electrical -- E4110 | EPO-TEK® E4110 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although other heat cures can be used. |
| Electrical -- E4110-LV | EPO-TEK® E4110-LV is a two component, silver-filled epoxy used in electronic and circuit assembly applications in semiconductor and optical industries. A low viscosity version of EPO-TEK® E4110. |
| Electrical -- E415G | EPO-TEK® E415G is a two component, silver-filled epoxy, designed for making electrical connections in semiconductor packaging and PCB assembly. |
| Electrical -- EE129-4 | EPO-TEK® EE129-4 is a room temperature cure, silver-filled epoxy, designed for making electrical connections in circuit assembly, semiconductor, and LCD applications. |
| Electrical -- EP110-R1 | EPO-TEK® EP110-R1 is a silver-filled epoxy which is similar to EPO-TEK® E4110, designed for potting and casting applications. |
| Electrical -- H20E | EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications... |
| Electrical -- H20E-175 | EPO-TEK® H20E-175 is a two component epoxy designed for semiconductor die-attach. It is a higher Tg version of EPO-TEK® H20E. It was designed to be used in semiconductor / JEDEC... |
| Electrical -- H20E-8 | EPO-TEK® H20E-8 is a two component, silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a higher viscosity and higher thixotropic version of EPO-TEK® |
| Electrical -- H20E-LV | EPO-TEK® H20E-LV is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a low viscosity version of EPO-TEK® H20E,... |
| Electrical -- H20E-PFC | EPO-TEK® H20E-PFC is a two component, semiconductor grade epoxy, designed for flip chip interconnects using a solder-free joining method. |
| Electrical -- H20F | EPO-TEK® H20F is a two component, flexible silver epoxy. It was designed for flexible type circuitry, such as switching circuits in a flexible panel system, as well as large die-attach... |
| Electrical -- H20S-MC | EPO-TEK® H20S-MC is a version of EPO-TEK® H20S, semiconductor die-attach epoxy. It was designed for improved electrical conductivity using a low temperature cure such as 90°C/90 minutes. In addition to... |
| Electrical -- H20S-P | EPO-TEK® H20S-P is a version of EPO-TEK® H20S, semiconductor die-attach epoxy. It was designed for improved electrical conductivity using a low temperature cure such as 80°C/4 hours. In addition to... |
| Electrical -- H21D | EPO-TEK® H21D is a two component, high Tg, silver-filled epoxy adhesive designed for chip bonding in microelectronic and optoelectronic applications. |
| Electrical -- H22 | EPO-TEK® H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages. |
| Electrical -- H24 | EPO-TEK® H24 is a two component, electrically and thermally conductive epoxy adhesive designed for semiconductor die attach and hybrid micro-electronics assembly. |
| Electrical -- H27D | EPO-TEK® H27D is a two component, silver-filled epoxy adhesive designed for semiconductor and hybrid-microelectronic packaging applications. |
| Electrical -- H31 | EPO-TEK® H31 is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic packaging. |
| Electrical -- H31D | EPO-TEK® H31D is a single component, electrically conductive silver epoxy designed for die-bonding of semiconductors, including IC's, resistors, capacitors, transistors, and diodes which may be found in opto-electronics packaging or... |
| Electrical -- H31LV | EPO-TEK® H31LV is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic packaging. Low viscosity version of EPO-TEK® H31. |
| Electrical -- H35-175MP | EPO-TEK® H35-175MP is a single component, silver-filled epoxy for military hybrid die and component attach. |
| Electrical -- H35-175MPLV | EPO-TEK® H35-175MPLV is a single component, silver-filled epoxy for military hybrid die and component attach. It is a lower viscosity version of EPO-TEK® H35-175MP. |
| Electrical -- H35-175MPT | EPO-TEK® H35-175MPT is a single component, silver-filled epoxy for military hybrid die and component attach. |
| Electrical -- H37-MP | EPO-TEK® H37-MP is a single component, electrically conductive, thixotropic silver-filled adhesive for die-attach and SMD attach inside hybrid microelectronic packages. Also available in a frozen syringe. |
| Electrical -- H44 | EPO-TEK® H44 is a single component, gold-filled, electrically conductive epoxy adhesive designed for hybrid microelectronic packaging. |
| General -- H54 | EPO-TEK® H54 is a two component, high Tg, electrically and thermally insulating epoxy adhesive for general bonding and high temperature packaging in medical, hybrid, and optical industries. |
| Thermal -- H61 | EPO-TEK® H61 is a single component, thermally conductive, electrically insulating, epoxy adhesive for semiconductor, hybrid IC, and electronic circuit assembly applications. |
| Thermal -- H77 Black | EPO-TEK® H77 Black is a two component, thermally conductive, electrically insulating epoxy system designed for lid-sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass, aluminum... |
| Electrical -- P1011 | EPO-TEK® P-1011 is a single component, modified polyimide, silver-filled adhesive designed for chip bonding in microelectronic and optoelectronic applications. |
| Thermal -- T7109 | EPO-TEK® T7109 is a two component, thermally conductive epoxy designed for die attach and heat-sinking applications found in the semiconductor, hybrid, medical and optical industries. |
| Thermal -- T7110 | EPO-TEK® T7110 is a two component, thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for... |
| Thermal -- T7139 | EPO-TEK® T7139 is a two component, electrically insulating, encapsulating epoxy designed for semiconductor glob top applications and package assembly. |
| UV -- UVO-114 | EPO-TEK® UVO-114 is a single component, UV curable epoxy, designed for adhesive, sealing, coating and encapsulating applications found in semiconductor, electro-optics, fiber optics, medical, and scientific/OEM industries. |
| General -- 360-ST, General -- 360-T | General type, insulative conductivity, oven, snap cure method |
| Optical -- OD2002 | High Tg version of EPO-TEK®353ND with low modulus and good toughness. Replacement forEPO-TEK® 364. |
| Optical -- 323LP | Longer pot life version of EPO-TEK® 353ND designed for semiconductor, hybrid, fiber-optic, hard-disk drive and medical applications. |
| Optical -- OE121-BLACK | Optical type, insulative conductivity, room cure method |
| Thermal -- H70E-2 | Product Description: EPO TEK® H70E-2 is a two component, thermally conductive electrically insulating epoxy designed for glob-top chip protection in TAB and COB die-attach technologies. It is used to prevent... |
| Thermal -- H65-175MP | Product Description: EPO-TEK® H65-175MP is a single component, alumina-filled epoxy for military hybrid die and component attach. It can also be used for semiconductor and high temperature ceramic and vacuum... |
| UV -- OG116-31 | Product Description: EPO-TEK® OG116-31 is a single component, UV curable epoxy adhesive and encapsulant, designed for PCB and circuit assembly applications found in semiconductor, computer, medical, and scientific/OEM industries. EPO-TEK® |
| Thermal -- H70S | Product Description:
EPO TEK® H70S is a modified version of EPO TEK® H70E, designed primarily for die stamping. It is a highly reliable, alumina- filled epoxy with a smooth, flowable... |
| Optical -- 301 | Product Description:
EPO-TEK® 301 is a two component, room temperature curing epoxy featuring very low viscosity, and excellent optical-mechanical properties.
EPO-TEK® 301 Advantages & Suggested Application Notes:
• Semiconductor: optical... |
| Optical -- 302 | Product Description:
EPO-TEK® 302 is a two component, fast-gelling, room temperature curing epoxy, designed for electronic, optical, medical, and general applications.
EPO-TEK® 302 Advantages & Application Notes:
• Due to... |
| Optical -- 302-3M | Product Description:
EPO-TEK® 302-3M is a two component epoxy used for optical, medical, fiber optic, and semiconductor applications. The epoxy is good for adhesive joining, sealing, potting, or as a... |
| Electrical -- E2001 | Product Description:
EPO-TEK® E2001 is a two component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile.
EPO-TEK® E2001 Advantages & Application Notes:
• This... |
| Electrical -- E2001-HV | Product Description:
EPO-TEK® E2001-HV Is a snap cure, two component, silver-filled die attach adhesive for semiconductor plastic IC packaging.
EPO-TEK® E2001-HV Advantages & Application Notes:
• Snap cure adhesive or... |
| Electrical -- E2082 | Product Description:
EPO-TEK® E2082 is a two-component, silver filled, electrically and thermally conductive adhesive for semiconductor die attach, hybrid, electronics and optical applications. It is a two-component version of EPO-TEK® |
| Electrical -- E2101 | Product Description:
EPO-TEK® E2101 is a two component, thixotropic, electrically conductive adhesive. It may be used for circuit assembly and semiconductor applications.
EPO-TEK® E2101 Advantages & Application Notes:
Thixotropic... |
| Electrical -- E3001, Electrical -- E3001-6 | Product Description:
EPO-TEK® E3001 is a one component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile.
EPO-TEK® E3001 Advantages & Application Notes:
• This... |
| Electrical -- E3001-HV | Product Description:
EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe.
EPO-TEK® E3001-HV Advantages & Application... |
| Thermal -- H62 | Product Description:
EPO-TEK® H62 is a single component, electrically insulating, and thermally conductive epoxy adhesive. It may be used for heat-sinking semiconductor, hybrids, or electronic circuits.
EPO-TEK® H62 Advantages & |
| Thermal -- H70E | Product Description:
EPO-TEK® H70E is a two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.
EPO-TEK® H70E Advantages & Application Notes:
Heat-sinking... |
| Thermal -- H70E-175 | Product Description:
EPO-TEK® H70E-175 is a two component, thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic and opto-electronic packaging. It may be used in aluminum heat sinking power devices... |
| Thermal -- H70E-4 | Product Description:
EPO-TEK® H70E-4 is a two component, thermally conductive, electrically insulating epoxy adhesive for semiconductor, micro-electronic and opto-electronic packaging. It may be used for heat sinking power devices in... |
| Thermal -- H72 | Product Description:
EPO-TEK® H72 is a two component, high Tg, thermally conductive and electrically insulating epoxy designed for semiconductor packaging including heat sinking, hermetic sealing, and opto-electronic assemblies.
EPO-TEK® H72... |
| Thermal -- H77 | Product Description:
EPO-TEK® H77 is a two component, thermally conductive, electrically insulating epoxy system designed for lid-sealing of hybrids found in hermetic packaging of micro-electronics. Lids can be ceramic, glass,... |
| Electrical -- H81 | Product Description:
EPO-TEK® H81 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid micro-electronic and semiconductor packaging.
EPO-TEK® H81 Advantages & Application Notes:
Gold filled... |
| Electrical -- N20E | Product Description:
EPO-TEK® N20E is a two component, electrically and thermally conductive, epoxy adhesive designed for semiconductor and electronics assembly. Its applications and field conditions include the optical, sensor, consumer,... |
| Optical -- OE188 | Product Description:
EPO-TEK® OE188 is a low CTE, designed for semiconductor and fiber optic applications.
EPO-TEK® OE188 Advantages & Application Notes:
• Paste-like viscosity allows for application by dispensing, or... |
| UV -- OG134 | Product Description:
EPO-TEK® OG134 is single component, optically clear, low refraction (Nd), UV curable epoxy adhesive for fiber optic and opto-electronic device packaging.
EPO-TEK® OG134 Advantages & Application Notes:
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| UV -- OG175 | Product Description:
EPO-TEK® OG175 is single component, optically clear, low refraction (Nd), UV curable epoxy adhesive for fiber optic and opto-electronic device packaging.
EPO-TEK® OG175 Advantages & Application Notes: Low... |
| Thermal -- H67-MPT | Thermal type, thermal conductivity, oven cure method |
| Thermal -- T905BN-3 | Thermally conductive, electrically insulating epoxy designed for heat sinking and encapsulation. Also ideal for large volume potting applications. |
| UV -- OG127-4, UV -- OG604-5 | UV type, insulative conductivity, UV light cure method |
