Xoxide Swiftech GTX560-TI Heatsink 70668

Description
The GTX560-TI heatsink is designed to cool surface mount components (memory, and voltage mosfets) on nVidia's GeForce® GTX560-TI series graphics cards (P1040 reference design). The product is designed to be installed in conjunction with our MCW60, 80 and 82 VGA waterblocks and it allows the highest possible stable overclocks of these high-end graphic cards while keeping them cool and quiet. For high-overclock applications where maximum voltage is added to the card, an optional slow speed (quiet) 80mm fan can be added to complement cooling of the power MOSFETS, resulting in up to 30% drop in these components temperature compared to stock cooling. The performance advantage of hybrid cooling which consists in cooling the GPU with a universal waterblock in combination with a heatsink compared to using a full-cover water-block solutions is well known among enthusiast users: improved thermal dissipation at the GPU level thanks to Swiftech's Diamond Pin Matrix and a better TIM joint, and less heat dumped into the liquid cooling loop coming from memory, and power MOSFETS since they remain air cooled. In addition, this combination provides a complete solution that is more economical than full-cover waterblocks because the GPU waterblock can be re-used over time with different VGA cards. The heatsink is a custom Aluminum extrusions, and it is precision CNC machined to allow optimum TIM joints with the hottest components such as the voltage regulator modules, where high performance thermal grease is to be used. Less heat intensive components such as memory receive pre-applied thermal pads. Specifications Material: black anodized aluminum extrusion Dimensions (Inch): 7 3/4 " (L) x 3 5/8" (W) x .7" (H) Dimensions (Metric): 198mm (L) x 92mm (W) x 18mm (H) Weight: 8.7 oz (248 g) Installation: high thermal conductivity pad for memory and direct-touch for power MOSFETS (Arctic Céramique included) Pre-existing mount holes for optional 80mm fan (x4) Support How to check for compatibility? The nVidia® reference design number can often be found in a code located below or next to the nVidia logo, as can be seen below; in the case of this particular heatsink, the code to look for would be "1040". Compatibility Database (as of 6-7-11) Brand Model PCB # Compatible ASUS ENGTX560 TI DCII TOP/2DI/1GD5 GeForce GTX 560 Ti (Fermi) 1GB C1040P No ASUS ENGTX560 TI DCII/2
Description
The GTX560-TI heatsink is designed to cool surface mount components (memory, and voltage mosfets) on nVidia's GeForce® GTX560-TI series graphics cards (P1040 reference design). The product is designed to be installed in conjunction with our MCW60, 80 and 82 VGA waterblocks and it allows the highest possible stable overclocks of these high-end graphic cards while keeping them cool and quiet. For high-overclock applications where maximum voltage is added to the card, an optional slow speed (quiet) 80mm fan can be added to complement cooling of the power MOSFETS, resulting in up to 30% drop in these components temperature compared to stock cooling. The performance advantage of hybrid cooling which consists in cooling the GPU with a universal waterblock in combination with a heatsink compared to using a full-cover water-block solutions is well known among enthusiast users: improved thermal dissipation at the GPU level thanks to Swiftech's Diamond Pin Matrix and a better TIM joint, and less heat dumped into the liquid cooling loop coming from memory, and power MOSFETS since they remain air cooled. In addition, this combination provides a complete solution that is more economical than full-cover waterblocks because the GPU waterblock can be re-used over time with different VGA cards. The heatsink is a custom Aluminum extrusions, and it is precision CNC machined to allow optimum TIM joints with the hottest components such as the voltage regulator modules, where high performance thermal grease is to be used. Less heat intensive components such as memory receive pre-applied thermal pads. Specifications Material: black anodized aluminum extrusion Dimensions (Inch): 7 3/4 " (L) x 3 5/8" (W) x .7" (H) Dimensions (Metric): 198mm (L) x 92mm (W) x 18mm (H) Weight: 8.7 oz (248 g) Installation: high thermal conductivity pad for memory and direct-touch for power MOSFETS (Arctic Céramique included) Pre-existing mount holes for optional 80mm fan (x4) Support How to check for compatibility? The nVidia® reference design number can often be found in a code located below or next to the nVidia logo, as can be seen below; in the case of this particular heatsink, the code to look for would be "1040". Compatibility Database (as of 6-7-11) Brand Model PCB # Compatible ASUS ENGTX560 TI DCII TOP/2DI/1GD5 GeForce GTX 560 Ti (Fermi) 1GB C1040P No ASUS ENGTX560 TI DCII/2

Suppliers

Company
Product
Description
Supplier Links
Swiftech GTX560-TI Heatsink - 70668 - Xoxide
Malvern, PA, USA
Swiftech GTX560-TI Heatsink
70668
Swiftech GTX560-TI Heatsink 70668
The GTX560-TI heatsink is designed to cool surface mount components (memory, and voltage mosfets) on nVidia's GeForce® GTX560-TI series graphics cards (P1040 reference design). The product is designed to be installed in conjunction with our MCW60, 80 and 82 VGA waterblocks and it allows the highest possible stable overclocks of these high-end graphic cards while keeping them cool and quiet. For high-overclock applications where maximum voltage is added to the card, an optional slow speed (quiet) 80mm fan can be added to complement cooling of the power MOSFETS, resulting in up to 30% drop in these components temperature compared to stock cooling. The performance advantage of hybrid cooling which consists in cooling the GPU with a universal waterblock in combination with a heatsink compared to using a full-cover water-block solutions is well known among enthusiast users: improved thermal dissipation at the GPU level thanks to Swiftech's Diamond Pin Matrix and a better TIM joint, and less heat dumped into the liquid cooling loop coming from memory, and power MOSFETS since they remain air cooled. In addition, this combination provides a complete solution that is more economical than full-cover waterblocks because the GPU waterblock can be re-used over time with different VGA cards. The heatsink is a custom Aluminum extrusions, and it is precision CNC machined to allow optimum TIM joints with the hottest components such as the voltage regulator modules, where high performance thermal grease is to be used. Less heat intensive components such as memory receive pre-applied thermal pads. Specifications Material: black anodized aluminum extrusion Dimensions (Inch): 7 3/4 " (L) x 3 5/8" (W) x .7" (H) Dimensions (Metric): 198mm (L) x 92mm (W) x 18mm (H) Weight: 8.7 oz (248 g) Installation: high thermal conductivity pad for memory and direct-touch for power MOSFETS (Arctic Céramique included) Pre-existing mount holes for optional 80mm fan (x4) Support How to check for compatibility? The nVidia® reference design number can often be found in a code located below or next to the nVidia logo, as can be seen below; in the case of this particular heatsink, the code to look for would be "1040". Compatibility Database (as of 6-7-11) Brand Model PCB # Compatible ASUS ENGTX560 TI DCII TOP/2DI/1GD5 GeForce GTX 560 Ti (Fermi) 1GB C1040P No ASUS ENGTX560 TI DCII/2

The GTX560-TI heatsink is designed to cool surface mount components (memory, and voltage mosfets) on nVidia's GeForce® GTX560-TI series graphics cards (P1040 reference design).
The product is designed to be installed in conjunction with our MCW60, 80 and 82 VGA waterblocks and it allows the highest possible stable overclocks of these high-end graphic cards while keeping them cool and quiet. For high-overclock applications where maximum voltage is added to the card, an optional slow speed (quiet) 80mm fan can be added to complement cooling of the power MOSFETS, resulting in up to 30% drop in these components temperature compared to stock cooling.
The performance advantage of hybrid cooling which consists in cooling the GPU with a universal waterblock in combination with a heatsink compared to using a full-cover water-block solutions is well known among enthusiast users: improved thermal dissipation at the GPU level thanks to Swiftech's Diamond Pin Matrix and a better TIM joint, and less heat dumped into the liquid cooling loop coming from memory, and power MOSFETS since they remain air cooled. In addition, this combination provides a complete solution that is more economical than full-cover waterblocks because the GPU waterblock can be re-used over time with different VGA cards.
The heatsink is a custom Aluminum extrusions, and it is precision CNC machined to allow optimum TIM joints with the hottest components such as the voltage regulator modules, where high performance thermal grease is to be used. Less heat intensive components such as memory receive pre-applied thermal pads.
Specifications

  • Material: black anodized aluminum extrusion
  • Dimensions (Inch): 7 3/4 " (L) x 3 5/8" (W) x .7" (H)
  • Dimensions (Metric): 198mm (L) x 92mm (W) x 18mm (H)
  • Weight: 8.7 oz (248 g)
  • Installation: high thermal conductivity pad for memory and direct-touch for power MOSFETS (Arctic Céramique included)
  • Pre-existing mount holes for optional 80mm fan (x4)

Support
How to check for compatibility?
The nVidia® reference design number can often be found in a code located below or next to the nVidia logo, as can be seen below; in the case of this particular heatsink, the code to look for would be "1040".
Compatibility Database (as of 6-7-11)

Brand Model

PCB #

Compatible

ASUS ENGTX560 TI DCII TOP/2DI/1GD5 GeForce GTX 560 Ti (Fermi) 1GBC1040PNo
ASUS ENGTX560 TI DCII/2
Supplier's Site

Technical Specifications

  Xoxide
Product Category Heat Sinks
Product Number 70668
Product Name Swiftech GTX560-TI Heatsink
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