Enzotech - Low profile Chipset block -SLF-1
Low Profile - The total height is 12mm which reduces the likelihood of interference with other components and provides the best efficiency within a limited space. Features:
Multiple push pin locations for universal mounting on various board assembly. (hole to hole distance 54.6mm and 59m).
Formed of pure copper for enhanced thermal conductivity.
Excellent surface flatness minimizes the interface between the heat source and heat sink.
Specifications:
Dimension
37x37x13.5(H) mm
Weight
51g
Material
Forged copper 1100
Base Flatness
Polished mirror surface, flatness for machined surfaces are typically in the range of 0.0003" to 0.0004"per inch
Enzotech - Low profile Chipset block -SLF-1
Low Profile - The total height is 12mm which reduces the likelihood of interference with other components and provides the best efficiency within a limited space.
Features:
- Multiple push pin locations for universal mounting on various board
assembly. (hole to hole distance 54.6mm and 59m).
- Formed of pure copper for enhanced thermal conductivity.
- Excellent surface flatness minimizes the interface between the heat source and heat sink.
Specifications:
|
Dimension | 37x37x13.5(H) mm |
|
Weight | 51g |
|
Material | Forged copper 1100 |
|
Base Flatness | Polished mirror surface, flatness for machined surfaces are typically in the range of 0.0003" to 0.0004"per inch |
