ToneCooling Technology Co., Ltd Molybdenum copper series 80800930

Molybdenum copper series is also a pseudo alloy. Molybdenum and copper are not miscible. It fully combines the high thermal conductivity, high melting point, low thermal expansion coefficient, and high thermal conductivity of molybdenum. The ratio of molybdenum to copper can be adjusted arbitrarily, MoxCuy, where x+y=100. The following table shows only a portion of the commonly used grades. Our molybdenum-copper alloy can achieve almost completely dense, defect-free, fine-grained structure. The air tightness of the helium mass spectrometer leak material is <5×10-9 Pa/m3.s, which is comparable to foreign products. Compared with tungsten copper, molybdenum copper has lower density and better rollability, making it suitable for the production of thin strip products. Additionally, molybdenum copper can be stamped, making it suitable for the cost-effective mass production of heat sink parts.

Molybdenum copper series: We supply high-performance alloys combining tungsten’s hardness with copper’s thermal conductivity. Function: Excellent heat dissipation and mechanical strength. Applications: Ideal for electronics cooling, aerospace, and electrical contacts, meeting high-temperature and durability needs. Sizes: Available in various forms and dimensions for precision applications. Target Customers: Electronics manufacturers, aerospace companies, and high-tech industries requiring advanced thermal and mechanical solutions.

Molybdenum copper series provides advanced cooling solutions for data centers, ensuring efficient thermal management, reducing
energy costs, and enhancing server performance and reliability in high-density environments
2.Molybdenum copper series offers high-performance cooling solutions for computing, optimizing thermal management to boost processing power,
maintain stability, and enhance efficiency in demanding high-performance computing environments.
3.Molybdenum copper series provides advanced cooling solutions for industrial automation, ensuring reliable temperature control, reducing
component overheating, and enhancing the performance and longevity of automation equipment.
4.Molybdenum copper series delivers precision cooling solutions for medical equipment, ensuring reliable operation, preventing
overheating, and extending the lifespan of critical devices in healthcare environments.

Lasers come in many different qualities,and carbon dioxide lasers are stillused in certain specific situations. However, solid-state lasers are currently the main type, and semiconductorlasers are the most common. The use of crystal” oxygen-free copper heat sinks was prevalent over a decade or two ago. The power density was relatively low, and tin was typicaly used as solder.Oxygen-free copper heat sinks can be utiized,nickel-plated instead of gold-plated,but gold-plated soldering offers betterreliabiity.The tungsten copper bar structure was developed to meet the demands for high power,high reliabiity,and long lifespan.

• Tungsten Copper Alloy: We supply high-performance alloys combining tungsten’s hardness with copper’s thermal conductivity.
• Function: Excellent heat dissipation and mechanical strength.
• Applications: Ideal for electronics cooling, aerospace, and electrical contacts, meeting high-temperature and durability needs.
• Sizes: Available in various forms and dimensions for precision applications.
• Target Customers: Electronics manufacturers, aerospace companies, and high-tech industries requiring advanced thermal and mechanical solutions.

• Electronics Cooling Applications: Coolserver provides advanced cooling solutions for data centers, ensuring efficient thermal management, reducing energy costs, and enhancing server performance and reliability in high-density environments.
• Aerospace and Defense Applications: Coolserver offers high-performance cooling solutions for computing, optimizing thermal management to boost processing power, maintain stability, and enhance efficiency in demanding high-performance computing environments.
• Electrical Contacts and Switchgear Applications: Coolserver provides advanced cooling solutions for industrial automation, ensuring reliable temperature control, reducing component overheating, and enhancing the performance and longevity of automation equipment.
• Medical equipment Applications: Coolserver delivers precision cooling solutions for medical equipment, ensuring reliable operation, preventing overheating, and extending the lifespan of critical devices in healthcare environments.

Nvidia Al GPU Liquid Cooling Server 3000W GPU liquid cooling cold plates for AI servers are becoming essential as AI […]

CMC is a sandwich composite sheet with a core material of molybdenum plate and oxygen-free copper plates on both sides. It was invented by Americans in the 1990s to solve the heat dissipation of F22 fighter power devices. This material combines the characteristics of molybdenum’s low thermal expansion coefficient and copper’s high thermal conductivity. The surface is covered with oxygen-free copper plates, eliminating the need to worry about airtightness. Additionally, the copper-coated surface facilitates electroplating. S-CMC is a multi-layer CMC with better symmetry. HS-CMC is a multi-layer composite sheet with holes in the core molybdenum plate. The central core hole is filled with oxygen-free copper, enhancing thermal conductivity in the Z direction. This unique variety was developed by our company in collaboration with Kyocera for 5G power devices.

Our Ceramic Matrix Composite (CMC) can be stamped into sheet parts and even made into multi-boss heat pipe products. The layer thickness ratio of CMC series materials can be adjusted arbitrarily to obtain different thermal expansion coefficients.

• Tungsten Copper Alloy: We supply high-performance alloys combining tungsten’s hardness with copper’s thermal conductivity.
• Function: Excellent heat dissipation and mechanical strength.
• Applications: Ideal for electronics cooling, aerospace, and electrical contacts, meeting high-temperature and durability needs.
• Sizes: Available in various forms and dimensions for precision applications.
• Target Customers: Electronics manufacturers, aerospace companies, and high-tech industries requiring advanced thermal and mechanical solutions.

• Electronics Cooling Applications: Coolserver provides advanced cooling solutions for data centers, ensuring efficient thermal management, reducing energy costs, and enhancing server performance and reliability in high-density environments.
• Aerospace and Defense Applications: Coolserver offers high-performance cooling solutions for computing, optimizing thermal management to boost processing power, maintain stability, and enhance efficiency in demanding high-performance computing environments.
• Electrical Contacts and Switchgear Applications: Coolserver provides advanced cooling solutions for industrial automation, ensuring reliable temperature control, reducing component overheating, and enhancing the performance and longevity of automation equipment.
• Medical equipment Applications: Coolserver delivers precision cooling solutions for medical equipment, ensuring reliable operation, preventing overheating, and extending the lifespan of critical devices in healthcare environments.

Copper/Kovar/Copper, Copper/Invar/Copper, and Copper/Steel/Copper series products are similar to CMC and CPC series sandwich composite materials. They combine the high thermal conductivity of copper with the low thermal expansion coefficient of Kovar, Invar, and steel.

Although the thermal conductivity of Kovar, Invar, and steel is much lower than that of molybdenum and molybdenum-copper alloy, their prices are lower, and the yield rate of composite materials is higher. Therefore, the cost is much lower than that of CMC and CPC.

According to literature reports,copper/Kovar/Copper,copper/Invar/Copper,and copper/Steel/Copper products are widely used internationally. We have developed these products for domestic research institutes and supplied them in small batches, but they have not been widely promoted.

• Tungsten Copper Alloy: We supply high-performance alloys combining tungsten’s hardness with copper’s thermal conductivity.
• Function: Excellent heat dissipation and mechanical strength.
• Applications: Ideal for electronics cooling, aerospace, and electrical contacts, meeting high-temperature and durability needs.
• Sizes: Available in various forms and dimensions for precision applications.
• Target Customers: Electronics manufacturers, aerospace companies, and high-tech industries requiring advanced thermal and mechanical solutions.

• Electronics Cooling Applications: Coolserver provides advanced cooling solutions for data centers, ensuring efficient thermal management, reducing energy costs, and enhancing server performance and reliability in high-density environments.
• Aerospace and Defense Applications: Coolserver offers high-performance cooling solutions for computing, optimizing thermal management to boost processing power, maintain stability, and enhance efficiency in demanding high-performance computing environments.
• Electrical Contacts and Switchgear Applications: Coolserver provides advanced cooling solutions for industrial automation, ensuring reliable temperature control, reducing component overheating, and enhancing the performance and longevity of automation equipment.
• Medical equipment Applications: Coolserver delivers precision cooling solutions for medical equipment, ensuring reliable operation, preventing overheating, and extending the lifespan of critical devices in healthcare environments.

ToneCooling IGBT heat sink is made from AlSiC material and features a Pin-fin design, offering excellent thermal performance to efficiently reduce IGBT module temperatures and extend the lifespan of equipment. Ideal for applications in power electronics, industrial control systems, and other high-power electronic devices.

Features of Pin Fin IGBT Heat Sink

• High-Quality AlSiC Material：Made from AlSiC, known for its high thermal conductivity for efficient heat transfer.
• Pin-Fin Design：Features a Pin-fin design, maximizing surface area for better heat dissipation efficiency.
• Compact Design：Designed to be space-efficient, allowing integration into compact and limited spaces without compromising performance.
• Customization Options：Available in custom sizes and specifications to fit various IGBT modules and system requirements.

ToneCooling’s IGBT Heat Sink is a high-performance thermal management solution designed specifically for power modules. Made from high-quality AlSiC material, known for its superior thermal conductivity, it efficiently dissipates heat and enhances the longevity of power electronics. The Pin-Fin design maximizes surface area, improving heat transfer and cooling performance, especially in applications with space constraints. These features combined ensure optimal temperature control in demanding environments like automotive, industrial automation, and power electronics sectors.

As an OEM manufacturer, ToneCooling offers full customization options to meet your specific cooling needs. Whether you need different sizes, designs, or specialized mounting options, we tailor our heat sinks to fit perfectly with your equipment requirements.

Our quality control standards ensure that every unit is tested for optimal performance, and we offer timely delivery to keep your production on track. Choose ToneCooling for your IGBT Heat Sink needs and benefit from a reliable, high-performance cooling solution.

Contact us now to receive a custom quote and discuss your specific project requirements.

Our IGBT Heat Sink is designed for a wide range of applications, ensuring efficient cooling and optimal performance in various industries. These include:

• Renewable Energy: Used in solar inverters and wind power converters, ensuring IGBT modules operate within safe temperature limits, enhancing system efficiency.
• Electric Vehicles (EVs): Maintains optimal temperatures in EV inverters and electric propulsion systems, improving overall vehicle performance and reliability.
• Industrial Automation: Helps manage heat dissipation in industrial machinery and automation systems, ensuring the longevity of critical components.
• Power Supply Units: Provides reliable thermal management for power supplies used in telecommunications, data centers, and other high-demand sectors.
• Transportation: Applied in electric vehicles, high-speed trains, and electric-driven naval vessels, contributing to the reliable performance of power electronics.
• Power Transmission: Ensures efficient cooling for systems like UHVDC transmission and flexible DC transmission.
• Other Applications: Supports frequency converters, signal processing, UPS systems, medical equipment, and laser devices.

Igbt Cold Plates is a high-performance thermal management solution engineered by ToneCooling for demanding applications. Layout drawing of IGBT […]

Nvidia Al GPU Liquid Cooling Server 3000W GPU liquid cooling cold plates for AI servers are becoming essential as AI […]

Water cooling provides superior heat dissipation for processors. This method allows higher clock speeds and greater system stability. Users achieve […]

This comprehensive guide covers the role of heatsinks solutions for industrial and OEM applications. ToneCooling provides expert insights on the […]

This comprehensive guide covers a guide to different solutions for industrial and OEM applications. ToneCooling provides expert insights on a […]

This comprehensive guide covers how are heat sinks solutions for industrial and OEM applications. ToneCooling provides expert insights on how […]

What Is Choosing Heat Sink Computers Cpu? This guide on Choosing the right heat provides key insights for engineers and […]

Introduction — Heat sink skiving Heat sink skiving is a big deal in the electronics industry. This involves taking a […]

Diamond copper is a composite material made of diamond powder and a copper alloy. It utilizes high-quality artificial synthetic diamond powder, which boasts a thermal conductivity of about 1000W/M.K and an extremely low thermal expansion coefficient. Through the appropriate process, the diamond particles and the copper alloy create a metallurgical bonding interface, resulting in the diamond copper composite material possessing outstanding thermal conductivity and a suitable thermal expansion coefficient.

Diamond aluminum, similar to diamond copper, has a lower density, but its thermal conductivity is slightly inferior to that of diamond copper.

Diamond copper and diamond aluminum are currently the best heat dissipation materials in our company. Single crystal diamond and CVD diamond exhibit high thermal conductivity, but their thermal expansion coefficient is too small. On the other hand, carbon fiber composite materials offer directional thermal expansion and thermal conductivity.

• Tungsten Copper Alloy: We supply high-performance alloys combining tungsten’s hardness with copper’s thermal conductivity.
• Function: Excellent heat dissipation and mechanical strength.
• Applications: Ideal for electronics cooling, aerospace, and electrical contacts, meeting high-temperature and durability needs.
• Sizes: Available in various forms and dimensions for precision applications.
• Target Customers: Electronics manufacturers, aerospace companies, and high-tech industries requiring advanced thermal and mechanical solutions.

• Electronics Cooling Applications: Coolserver provides advanced cooling solutions for data centers, ensuring efficient thermal management, reducing energy costs, and enhancing server performance and reliability in high-density environments.
• Aerospace and Defense Applications: Coolserver offers high-performance cooling solutions for computing, optimizing thermal management to boost processing power, maintain stability, and enhance efficiency in demanding high-performance computing environments.
• Electrical Contacts and Switchgear Applications: Coolserver provides advanced cooling solutions for industrial automation, ensuring reliable temperature control, reducing component overheating, and enhancing the performance and longevity of automation equipment.
• Medical equipment Applications: Coolserver delivers precision cooling solutions for medical equipment, ensuring reliable operation, preventing overheating, and extending the lifespan of critical devices in healthcare environments.

Nvidia Al GPU Liquid Cooling Server 3000W GPU liquid cooling cold plates for AI servers are becoming essential as AI […]

CMc is a sandwich composite sheet with a core material of molybdenum plate and oxygen-free copper plates on both sides.It was invented by Americans in the 1990s to solve the heat dissipation of F22 fighter power devices. This material combines the characteristics of molybdenum’s low thermal expansion coefficient and copper’s high thermal conductivity.The surface is covered with oxygen-free copper plates, eliminating the need to worry about airtightness.Additionally,the copper-coated surface faciitates electroplating.s-CMC is a multi-layer CMC with better symmetry.Hs-CMC is a multi-layer composite sheet with holes in the core molybdenum plate.The central core hole is filed with oxygen-free copper,enhancing thermal conductivity in the Z direction.This unique variety was developed by our company in collaboration with kyocera for 5G power devices.

OurCeramic MatrixComposite (CMC) can be stamped into sheet parts and even made into multi-boss heat pipe products. The layer thickness ratio of CMC series materials can be adjusted arbitrarily to obtain different thermal expansion coefficients.

• Tungsten Copper Alloy: We supply high-performance alloys combining tungsten’s hardness with copper’s thermal conductivity.
• Function: Excellent heat dissipation and mechanical strength.
• Applications: Ideal for electronics cooling, aerospace, and electrical contacts, meeting high-temperature and durability needs.
• Sizes: Available in various forms and dimensions for precision applications.
• Target Customers: Electronics manufacturers, aerospace companies, and high-tech industries requiring advanced thermal and mechanical solutions.

• Electronics Cooling Applications: Coolserver provides advanced cooling solutions for data centers, ensuring efficient thermal management, reducing energy costs, and enhancing server performance and reliability in high-density environments.
• Aerospace and Defense Applications: Coolserver offers high-performance cooling solutions for computing, optimizing thermal management to boost processing power, maintain stability, and enhance efficiency in demanding high-performance computing environments.
• Electrical Contacts and Switchgear Applications: Coolserver provides advanced cooling solutions for industrial automation, ensuring reliable temperature control, reducing component overheating, and enhancing the performance and longevity of automation equipment.
• Medical equipment Applications: Coolserver delivers precision cooling solutions for medical equipment, ensuring reliable operation, preventing overheating, and extending the lifespan of critical devices in healthcare environments.

Nvidia Al GPU Liquid Cooling Server 3000W GPU liquid cooling cold plates for AI servers are becoming essential as AI […]

Custom Heat Sink Solutions from Coolserver for Electronics Cooling

CPU coolserver B6

The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling module is widely praised for its innovative design, efficient performance and affordable price.When purchasing, please make sure it is compatible with the CPU model and follow the installation instructions to ensureThe heat dissipation effect extends the service life of the computer.

• Small batch customization with quick proofing
• Efficient heat dissipation and intelligent temperature control.
• Compatibility and easy installation.
• Compatible with, and manufactured from highly thermally conductive materials such as copper and aluminum.
• Durability and reliability.
• Seamless and perfect joint, no worries about leakage.

• High Thermal Performance: Efficiently dissipates heat to enhance cooling in servers and data centers.
• Customizable Designs: Tailored to specific cooling needs with various sizes and configurations.
• Robust Construction: Durable materials designed to endure high-demand server environments.
• Efficient Airflow: Optimizes airflow for even cooling and reduced overheating risks.
• Energy Efficiency: Maximizes cooling while minimizing energy consumption and operational costs.
• Scalability: Supports growing data centers with effective thermal management.

• Data Center Applications: Coolserver provides advanced cooling solutions for data centers, ensuring efficient thermal management, reducing energy costs, and enhancing server performance and reliability in high-density environments.
• High Performance Computing Applications: Coolserver offers high-performance cooling solutions for computing, optimizing thermal management to boost processing power, maintain stability, and enhance efficiency in demanding high-performance computing environments.
• Industrial Automation Applications: Coolserver provides advanced cooling solutions for industrial automation, ensuring reliable temperature control, reducing component overheating, and enhancing the performance and longevity of automation equipment.
• Medical equipment Applications: Coolserver delivers precision cooling solutions for medical equipment, ensuring reliable operation, preventing overheating, and extending the lifespan of critical devices in healthcare environments.