Wurth Elektronik GmbH & Co. KG Thermal Pads 40113010

Description
TGF Thermal Pad Square; 100 x 100 x 1mm
Request a Quote Datasheet
Description
TGF Thermal Pad Square; 100 x 100 x 1mm
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Pads - 2420151 - RS Components, Ltd.
Corby, Northants, United Kingdom
Thermal Pads
2420151
Thermal Pads 2420151
TGF Thermal Pad Square; 100 x 100 x 1mm

TGF Thermal Pad Square; 100 x 100 x 1mm

Supplier's Site
Pads, Sheets, Bridges - 732-40113010-ND - DigiKey
Thief River Falls, MN, United States
Pads, Sheets, Bridges
732-40113010-ND
Pads, Sheets, Bridges 732-40113010-ND
Thermal Pad Blue 100.00mm x 100.00mm Square

Thermal Pad Blue 100.00mm x 100.00mm Square

Buy Now Datasheet
Thermally Cond Material, Silicone, 1Mm Rohs Compliant Wurth Elektronik - 66AJ9754 - Newark, An Avnet Company
Chicago, IL, United States
Thermally Cond Material, Silicone, 1Mm Rohs Compliant Wurth Elektronik
66AJ9754
Thermally Cond Material, Silicone, 1Mm Rohs Compliant Wurth Elektronik 66AJ9754
THERMALLY COND MATERIAL, SILICONE, 1MM ROHS COMPLIANT: YES

THERMALLY COND MATERIAL, SILICONE, 1MM ROHS COMPLIANT: YES

Supplier's Site

Technical Specifications

  RS Components, Ltd. DigiKey Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials Leveling and Filling Compounds Thermal Compounds and Thermal Interface Materials
Product Number 2420151 732-40113010-ND 66AJ9754
Product Name Thermal Pads Pads, Sheets, Bridges Thermally Cond Material, Silicone, 1Mm Rohs Compliant Wurth Elektronik
Thermal Conductivity 3 W/m-K (1.73 BTU-ft/hr-ft²-F) 3 W/m-K (1.73 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

High Performance Thermal Gap Filler - SARCON® GR130A - Fujipoly® America Corp.
Specs
Form / Shape Pad; Gap Filler, Foam in Place Gasket
Chemical System Silicone
Gap Fill 0.0118 to 0.0787 inch (0.3000 to 2 mm)
View Details
Underfill Materials for Printed Circuit Boards (PCBs) - ALPHA ® HiTech ® CU31-3300 - MacDermid Alpha Electronics Solutions
Specs
Industry Electronics; Semiconductors, IC's
Elongation 10.1 %
Dielectric Strength 635 kV/in (250 kV/cm)
View Details
Low Thermal Resistance Carbon Fiber Thermal Gap Pad for Semiconductor Heat Sinks - CSF45 - Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Pad
Industry Electronics
Use Temperature ? to 320 F (? to 160 C)
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details