MacDermid Alpha Electronics Solutions Advanced Hybrid Sintering Die Attach Solutions ATROX ® 800HT2VX

Product Overview A hybrid silver sintered die attach paste designed for high-power semiconductor packages with metallized dies. It features exceptional thermal conductivity, low resin bleed-out, and minimal condensable organics, ensuring outstanding package reliability in demanding applications such as automotive and 5G technology. This pressureless attachment solution supports high-temperature operations and enables high-volume manufacturing. Product Features Hybrid Silver Sintered Composition A hybrid silver sintered composition that delivers exceptional thermal conductivity, ensuring efficient heat dissipation. PFAS-Free Formulation PFAS-free, in compliance with environmental regulations, the elimination of per- and Polyfluoroalkyl Substances (PFAS) ensures safer handling and application. Featured Applications RF Amplifiers The high viscosity and thixotropic properties of ATROX® 800HT2VX enable precise application in high-power Radio Frequency (RF) amplifiers. Automotive With strong adhesion even under high temperatures, ATROX® 800HT2VX is ideal for die attach in automotive applications. LED Devices The sub-micron particle size of ATROX® 800HT2VX enables a low bond line thickness without voiding, making it ideal for applications in Light-Emitting Diode (LED) devices. Power Management ICs Supports high yield and throughput in automated manufacturing processes, making it an excellent choice for die attach in power Integrated Circuits (ICs).