IC DRAM 256MBIT PAR 54VFBGA Product overview: W988D6FBGX6E from Winbond Electronics Corporation is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-W988D6FBGX6E can be used for catalog matching and distributor lookup.
Manufacturer: Winbond Electronics
Win Source Part Number: 1280295-W988D6FBGX6E
Packaging: Tray
Mounting Style: SMD
Technology: SDRAM - Mobile LPSDR
Memory Type: Volatile
Memory Size: 256Mb (16M x 16)
Access Time: 5.4ns
Family Name: W988D6FB
Categories: Integrated Circuits
Supplier Device Package: 54-VFBGA (8x9)
Temperature Range - Operating: -25°C ~ 85°C
Memory Format: DRAM
Manufacturer Homepage: www.winbond.com
Clock Frequency: 166MHz
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Manufacturer Package: 54-TFBGA
Alternative Parts (Cross-Reference): NT6SM16M16AG-S1; W988D6FBGX6I;
Introduction Date: April 28, 2011
ECCN: EAR99
Country of Origin: Taiwan
Estimated EOL Date: 2022
Is this a common-used part?: Yes
Popularity: High
Fake Threat In the Open Market: 65 pct.
Supply and Demand Status: Limited
Manufacturer Pack Quantity: 312
MSL Level: 3 (168 Hours)
Supply Voltage (V): 1.7V ~ 1.95V
SDRAM - Mobile LPSDR Memory IC 256Mb (16M x 16) Parallel 166MHz 5.4ns 54-VFBGA (8x9)
SDRAM - Mobile LPSDR Memory IC 256Mbit Parallel 166 MHz 5.4 ns 54-VFBGA (8x9)
IC DRAM 256MBIT PARALLEL 54VFBGA
IC DRAM 256MBIT PARALLEL 54VFBGA
DRAM Chip Mobile LPSDR SDRAM 256M-Bit 16Mx16 1.8V
| ERSAELECTRONICS PTE. LTD. | Win Source Electronics | DigiKey | Quarktwin Technology Ltd. | Lingto Electronic Limited | Shenzhen Shengyu Electronics Technology Limited | Utmel Electronic Limited | |
|---|---|---|---|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | 774-W988D6FBGX6E | 1280295-W988D6FBGX6E | W988D6FBGX6E-ND | W988D6FBGX6E | W988D6FBGX6E | W988D6FBGX6E | 888-W988D6FBGX6E |
| Product Name | Memory IC and Storage Component | Memory - SDRAM - W988D6FBGX6E | Memory | Memory | Memory | Integrated Circuits (ICs) - Memory | DRAM Chip Mobile LPSDR SDRAM 256M-Bit 16Mx16 1.8V |
| Memory Category | Volatile; DRAM Chip | Volatile; DRAM Chip | DRAM Chip | DRAM; DRAM Chip | DRAM; DRAM Chip | Volatile; DRAM Chip | Volatile; DRAM Chip |
| Access Time | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | |
| Cycle Time | 15 ns | 15 ns | 15 ns | ||||
| Operating Temperature | -25 to 85 C (-13 to 185 F) | -25 to 85 C (-13 to 185 F) | -25 to 85 C (-13 to 185 F) | -25 to 85 C (-13 to 185 F) | -25 to 85 C (-13 to 185 F) | -25 to 85 C (-13 to 185 F) | |
| Package Type | BGA; Tray | 54-TFBGA | BGA; 54-TFBGA | BGA | 54-TFBGA |
