Winbond Electronics Corporation America Memory - DDR - W632GG6KB-11 W632GG6KB-11

Description
Win Source Part Number: 941410-W632GG6KB-11 Series: * Categories: Memory
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Description
Win Source Part Number: 941410-W632GG6KB-11 Series: * Categories: Memory
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Memory - DDR - W632GG6KB-11 - 941410-W632GG6KB-11 - Win Source Electronics
Laguna Hills, CA, United States
Memory - DDR - W632GG6KB-11
941410-W632GG6KB-11
Memory - DDR - W632GG6KB-11 941410-W632GG6KB-11
Win Source Part Number: 941410-W632GG6KB-11 Series: * Categories: Memory

Win Source Part Number: 941410-W632GG6KB-11
Series: *
Categories: Memory

Buy Now
Memory - W632GG6KB-11-ND - DigiKey
Thief River Falls, MN, United States
SDRAM - DDR3 Memory IC 2Gb (128M x 16) Parallel 933MHz 20ns 96-WBGA (9x13)

SDRAM - DDR3 Memory IC 2Gb (128M x 16) Parallel 933MHz 20ns 96-WBGA (9x13)

Buy Now Datasheet
Memory IC and Storage Component - 774-W632GG6KB-11 - ERSAELECTRONICS PTE. LTD.
Singapore
Memory IC and Storage Component
774-W632GG6KB-11
Memory IC and Storage Component 774-W632GG6KB-11
IC DRAM 2GBIT PAR 96WBGA Product overview: W632GG6KB-11 from Winbond Electronics Corporation is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-W632GG6KB-11 can be used for catalog matching and distributor lookup.

IC DRAM 2GBIT PAR 96WBGA Product overview: W632GG6KB-11 from Winbond Electronics Corporation is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-W632GG6KB-11 can be used for catalog matching and distributor lookup.

Supplier's Site Datasheet
IC DRAM 2GBIT PARALLEL 96WBGA

IC DRAM 2GBIT PARALLEL 96WBGA

Supplier's Site Datasheet
Integrated Circuits (ICs) - Memory - W632GG6KB-11 - Shenzhen Shengyu Electronics Technology Limited
Futian, China
Integrated Circuits (ICs) - Memory
W632GG6KB-11
Integrated Circuits (ICs) - Memory W632GG6KB-11
IC DRAM 2GBIT PARALLEL 96WBGA

IC DRAM 2GBIT PARALLEL 96WBGA

Supplier's Site
Memory - W632GG6KB-11 - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
SDRAM - DDR3 Memory IC 2Gbit Parallel 933 MHz 20 ns 96-WBGA (9x13)

SDRAM - DDR3 Memory IC 2Gbit Parallel 933 MHz 20 ns 96-WBGA (9x13)

Buy Now Datasheet

Technical Specifications

  Win Source Electronics DigiKey ERSAELECTRONICS PTE. LTD. Lingto Electronic Limited Shenzhen Shengyu Electronics Technology Limited Quarktwin Technology Ltd.
Product Category Memory Chips Memory Chips Memory Chips Memory Chips Memory Chips Memory Chips
Product Number 941410-W632GG6KB-11 W632GG6KB-11-ND 774-W632GG6KB-11 W632GG6KB-11 W632GG6KB-11 W632GG6KB-11
Product Name Memory - DDR - W632GG6KB-11 Memory Memory IC and Storage Component Memory Integrated Circuits (ICs) - Memory Memory
Memory Category DRAM Chip Volatile; DRAM Chip DRAM; DRAM Chip Volatile; DRAM Chip DRAM; DRAM Chip
Operating Temperature 0 to 95 C (32 to 203 F) 0 to 95 C (32 to 203 F) 0 to 95 C (32 to 203 F) 0 to 95 C (32 to 203 F)
Package Type 96-TFBGA BGA; Tray BGA BGA; 96-TFBGA
Supply Voltage 1.425V ~ 1.575V 1.425V ~ 1.575V 1.425V ~ 1.575V 1.425V ~ 1.575V
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