Vishay Precision Group Thermal Jumper, Alumi Nitride, 170W/m.k; Thermal Conductivity Vishay THJP1225ABT1

Description
THERMAL JUMPER, ALUMI NITRIDE, 170W/M.K; Thermal Conductivity:170W/m. K; Conductive Material:Aluminium Nitride; Thickness:0.03"; Thermal Impedance:4°C/W; Dielectric Strength:-; External Length:0.126"; External Width:0.252"
Datasheet
Description
THERMAL JUMPER, ALUMI NITRIDE, 170W/M.K; Thermal Conductivity:170W/m. K; Conductive Material:Aluminium Nitride; Thickness:0.03"; Thermal Impedance:4°C/W; Dielectric Strength:-; External Length:0.126"; External Width:0.252"
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Jumper, Alumi Nitride, 170W/m.k; Thermal Conductivity Vishay - 59AJ2394 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Jumper, Alumi Nitride, 170W/m.k; Thermal Conductivity Vishay
59AJ2394
Thermal Jumper, Alumi Nitride, 170W/m.k; Thermal Conductivity Vishay 59AJ2394
THERMAL JUMPER, ALUMI NITRIDE, 170W/M.K; Thermal Conductivity:170W/m. K; Conductive Material:Aluminium Nitride; Thickness:0.03"; Thermal Impedance:4°C/W; Dielectric Strength:-; External Length:0.126"; External Width:0.252"

THERMAL JUMPER, ALUMI NITRIDE, 170W/M.K; Thermal Conductivity:170W/m.K; Conductive Material:Aluminium Nitride; Thickness:0.03"; Thermal Impedance:4°C/W; Dielectric Strength:-; External Length:0.126"; External Width:0.252"

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 59AJ2394
Product Name Thermal Jumper, Alumi Nitride, 170W/m.k; Thermal Conductivity Vishay
Thermal Conductivity 170 W/m-K (98.22 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Advanced Hybrid Sintering Die Attach Solutions - ATROX ® CD 590-HT2 - MacDermid Alpha Electronics Solutions
Specs
Cure / Technology Thermoset
Form / Shape Die Bonding Adhesives
Industry Electronics; Semiconductors, IC's
View Details
Thermal conductive gel pad for mobile phone smartphone - SF400 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Pad
Industry Electronics
Use Temperature -58 to 392 F (-50 to 200 C)
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
2-Part, Silicone Potting Compound and Encapsulant, UL Listed - QSil-563 - CHT USA Inc.
Specs
Cure / Technology Two Component  ; Addition
Industry Automotive; Electronics
Features Flame Retardant; UL Rating
View Details