Universal Semiconductor, Inc. USC1852

Description
The USC1852 utilizes the USC1850 die for low cost 8 bit conversion in a 20 pin package. USC1852 is available in several package types with accuracy ranging from 1 LSB to 6 LSB.
Datasheet
Description
The USC1852 utilizes the USC1850 die for low cost 8 bit conversion in a 20 pin package. USC1852 is available in several package types with accuracy ranging from 1 LSB to 6 LSB.
Datasheet

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San Jose, CA, USA
USC1852
USC1852
The USC1852 utilizes the USC1850 die for low cost 8 bit conversion in a 20 pin package. USC1852 is available in several package types with accuracy ranging from 1 LSB to 6 LSB.

The USC1852 utilizes the USC1850 die for low cost 8 bit conversion in a 20 pin package. USC1852 is available in several package types with accuracy ranging from 1 LSB to 6 LSB.

Datasheet

Technical Specifications

  Universal Semiconductor, Inc.
Product Category Digital-to-Analog Converter (DAC) Chips
Product Number USC1852
Package Type SOIC; DIP; CERDIP, Leadless Chip Carrier, Die
Production Status Full-Production
Screening Level Commercial; Industrial
Packing Method Bulk
Features Single-Supply
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