ARAMIS is a powerful optical system for measurement of complex materials and structures for their 3D deformation and strain during loading. This tool is a highly robust, full-field, non-contact strain measuring testing device. The system offers a non-contact measurement of 3D deformation and strain using 3D image correlation methods (digital image correlation, DIC) using high-resolution digital CCD cameras.
The object under load is viewed by one (2D) or two (3D) high-resolution digital CCD cameras. The deformation of this structure under different load conditions is recorded by the CCD cameras and evaluated using digital image processing. The results are the 3D-coordinates, 3D displacements, the surface strain and the complete strain tensor.
Common uses include:
- Materials characterization of metallics, composites, ceramics - Thermal Expansion Measurements - FEM confirmation & boundary condition checking - Fracture mechanics and Estimating stability - Dimensioning components - Examining non-linear deformation behavior - Characterizing creep and aging processes - High-speed deformation & strain measurements