Techsil Limited Techsil® Silicone Ink 20% Yellow 500gm TESI01017

Description
Techsil Silicone Ink is a one-component, flowable, heat curing ink, which offers primer less adhesion to a wide variety of substrates. When using on difficult to bond substrates, or a more aggressive chemical bond is required, SS4155 can be used to enhance adhesion. 20% (by weight) of yellow silicone pigment has been added to the TSI to give its color density. Techsil® Silicone Ink contains no solvent and is a one component product, meaning there is no mixing required. It offers a fast cure at elevated temperatures, and gives no cure by-products. It is non-corrosive to metals and sensitive substrates and offers excellent dielectric properties.
Datasheet
Description
Techsil Silicone Ink is a one-component, flowable, heat curing ink, which offers primer less adhesion to a wide variety of substrates. When using on difficult to bond substrates, or a more aggressive chemical bond is required, SS4155 can be used to enhance adhesion. 20% (by weight) of yellow silicone pigment has been added to the TSI to give its color density. Techsil® Silicone Ink contains no solvent and is a one component product, meaning there is no mixing required. It offers a fast cure at elevated temperatures, and gives no cure by-products. It is non-corrosive to metals and sensitive substrates and offers excellent dielectric properties.
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Techsil® Silicone Ink 20% Yellow 500gm - TESI01017 - Techsil Limited
Bidford on Avon, United Kingdom
Techsil® Silicone Ink 20% Yellow 500gm
TESI01017
Techsil® Silicone Ink 20% Yellow 500gm TESI01017
Techsil Silicone Ink is a one-component, flowable, heat curing ink, which offers primer less adhesion to a wide variety of substrates. When using on difficult to bond substrates, or a more aggressive chemical bond is required, SS4155 can be used to enhance adhesion. 20% (by weight) of yellow silicone pigment has been added to the TSI to give its color density. Techsil® Silicone Ink contains no solvent and is a one component product, meaning there is no mixing required. It offers a fast cure at elevated temperatures, and gives no cure by-products. It is non-corrosive to metals and sensitive substrates and offers excellent dielectric properties.

Techsil Silicone Ink is a one-component, flowable, heat curing ink, which offers primer less adhesion to a wide variety of substrates. When using on difficult to bond substrates, or a more aggressive chemical bond is required, SS4155 can be used to enhance adhesion. 20% (by weight) of yellow silicone pigment has been added to the TSI to give its color density. Techsil® Silicone Ink contains no solvent and is a one component product, meaning there is no mixing required. It offers a fast cure at elevated temperatures, and gives no cure by-products. It is non-corrosive to metals and sensitive substrates and offers excellent dielectric properties.

Supplier's Site Datasheet

Technical Specifications

  Techsil Limited
Product Category Resins and Compounds
Product Number TESI01017
Product Name Techsil® Silicone Ink 20% Yellow 500gm
Chemical System Silicone
Unlock Full Specs
to access all available technical data

Similar Products

Fluon+ ™ Filled PTFE Compounds - FC 103 - AGC Chemicals Americas, Inc.
AGC Chemicals Americas, Inc.
Specs
Type Thermoplastic
Form / Shape Pellets
Chemical System Fluoropolymer
View Details
Ducoya® - G202 C - Duvelco Limited
Duvelco Limited
Specs
Type Thermoplastic
Form / Shape Pellets
Chemical System Polyimide or Bismaleimide (BMI)
View Details
Rigid and Castable Absorbers -  - Dexmet® Corporation, a part of PPG’s engineered materials division
Dexmet® Corporation, a part of PPG’s engineered materials division
Specs
Type Thermally cured
Chemical System Epoxy; Silicone
Features EMI / RFI Shielding Material
View Details
Two Component, Epoxy Resin Systems - EP21LSCL-1 - Master Bond, Inc.
Specs
Type Thermally cured
Chemical System Epoxy
Industry Aerospace; Automotive; Electronics; Electrical Power or High Voltage; Laminating; Marine; Optoelectronics or Photonics; OEM or Industrial; Semiconductors or IC Packaging; Chemical/Oil Processing/Metal Working
View Details