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Techsil Limited Techsil® Non Silicone Heat Transfer Compound 620gm TEOT04005

Description
Techsil® HTC is a non-silicone heat transfer compound with a high thermal conductivity (0.9W/mK) designed for thermal coupling of electrical components. HTC is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required or between any surface where thermal conductivity or heat dissipation is important. HTC contains no silicones and thus cannot migrate onto electrical contacts with consequent high contact resistance, arcing or mechanical wear. Similarly, soldering problems caused by silicones will not be encountered. HTC will perform in applications where the maximum service temperature does not exceed +130°C. Applications that need to operate beyond this limit will require a silicone based product. Product Features Excellent non-creep characteristics Wide operating temperature range Excellent thermal conductivity even at high temperatures Easy to handle Economic in use Low in toxicity Low evaporation weight loss Technical Properties Colour:White Operating Temperature: -50°C to +130°C
Datasheet

Suppliers

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Product
Description
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Techsil® Non Silicone Heat Transfer Compound 620gm - TEOT04005 - Techsil Limited
Bidford on Avon, United Kingdom
Techsil® Non Silicone Heat Transfer Compound 620gm
TEOT04005
Techsil® Non Silicone Heat Transfer Compound 620gm TEOT04005
Techsil® HTC is a non-silicone heat transfer compound with a high thermal conductivity (0.9W/mK) designed for thermal coupling of electrical components. HTC is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required or between any surface where thermal conductivity or heat dissipation is important. HTC contains no silicones and thus cannot migrate onto electrical contacts with consequent high contact resistance, arcing or mechanical wear. Similarly, soldering problems caused by silicones will not be encountered. HTC will perform in applications where the maximum service temperature does not exceed +130°C. Applications that need to operate beyond this limit will require a silicone based product. Product Features Excellent non-creep characteristics Wide operating temperature range Excellent thermal conductivity even at high temperatures Easy to handle Economic in use Low in toxicity Low evaporation weight loss Technical Properties Colour:White Operating Temperature: -50°C to +130°C

Techsil® HTC is a non-silicone heat transfer compound with a high thermal conductivity (0.9W/mK) designed for thermal coupling of electrical components. HTC is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required or between any surface where thermal conductivity or heat dissipation is important.

HTC contains no silicones and thus cannot migrate onto electrical contacts with consequent high contact resistance, arcing or mechanical wear. Similarly, soldering problems caused by silicones will not be encountered. HTC will perform in applications where the maximum service temperature does not exceed +130°C. Applications that need to operate beyond this limit will require a silicone based product.

Product Features

  • Excellent non-creep characteristics
  • Wide operating temperature range
  • Excellent thermal conductivity even at high temperatures
  • Easy to handle
  • Economic in use
  • Low in toxicity
  • Low evaporation weight loss

Technical Properties

  • Colour:White
  • Operating Temperature: -50°C to +130°C
Supplier's Site Datasheet

Technical Specifications

  Techsil Limited
Product Category Encapsulants and Potting Compounds
Product Number TEOT04005
Product Name Techsil® Non Silicone Heat Transfer Compound 620gm
Type Thermally Conductive
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