Techsil® Non Silicone Heat Transfer Compound (part number TEOT04005) is a non-curing thermal interface material designed for efficient heat dissipation between electronic components. It is formulated from a blend of synthetic fluids and powdered metal oxides, providing a thermal conductivity of 0.9 W/m.K. This compound is particularly suitable for applications where silicone materials are prohibited, as it avoids issues related to silicone migration and associated contact resistance.
The compound operates effectively within a temperature range of -50°C to +130°C and exhibits low evaporation weight loss, making it reliable for long-term use. Its non-creeping characteristics and ease of application contribute to its effectiveness in enhancing thermal coupling. The product is RoHS-2 compliant, ensuring it meets environmental regulations. It is recommended for use in various electronic applications, including diodes, transistors, heat sinks, and power resistors.
Techsil® HTC is a non-silicone heat transfer compound with a high thermal conductivity (0.9W/mK) designed for thermal coupling of electrical components. HTC is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required or between any surface where thermal conductivity or heat dissipation is important.
HTC contains no silicones and thus cannot migrate onto electrical contacts with consequent high contact resistance, arcing or mechanical wear. Similarly, soldering problems caused by silicones will not be encountered. HTC will perform in applications where the maximum service temperature does not exceed +130°C. Applications that need to operate beyond this limit will require a silicone based product.
Product Features
Technical Properties
| Techsil Limited | |
|---|---|
| Product Category | Encapsulants and Potting Compounds |
| Product Number | TEOT04005 |
| Product Name | Techsil® Non Silicone Heat Transfer Compound 620gm |
| Type | Thermally Conductive |
