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Techsil Limited Momentive TIA241GF Thermal Gap Filler 3.6kg Kit MOSI17211

Description
Momentive TIA241GF is a 2 part, thermally conductive silicone that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, the non-slumping paste consistency of TIA214GF provides physical stability to prevent run-off after dispense. Recommended for use as a liquid dispensed alternative to pre-fabricated thermal pads and as a gap filler for a broad array of thermal designs in electronic components. Suitable for use in consumer, telecommunications, automotive and lighting electronic component applications. Product Benefits Good Thermal Conductivity Low temperature, fast cure Easy to use Retains softness after cure to contribute to stress relief during thermal cycling Conforms to complex shapes of 3-dimentional interface designs Repairable Flame Retardant:UL94V-0 equivalent Technical Properties Uncured Consistency:Blue Paste Cured Shore Hardness:45 A Thermal Conductivity:4.1 W/mK Thermal Resistance:30 mm2.K/W Dielectric Strength:16 kV/mm Tensile Strength:0.2 Mpa Elongation:40% Operating Temperature:-60°C to +200°C
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Momentive TIA241GF Thermal Gap Filler 3.6kg Kit - MOSI17211 - Techsil Limited
Bidford on Avon, United Kingdom
Momentive TIA241GF Thermal Gap Filler 3.6kg Kit
MOSI17211
Momentive TIA241GF Thermal Gap Filler 3.6kg Kit MOSI17211
Momentive TIA241GF is a 2 part, thermally conductive silicone that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, the non-slumping paste consistency of TIA214GF provides physical stability to prevent run-off after dispense. Recommended for use as a liquid dispensed alternative to pre-fabricated thermal pads and as a gap filler for a broad array of thermal designs in electronic components. Suitable for use in consumer, telecommunications, automotive and lighting electronic component applications. Product Benefits Good Thermal Conductivity Low temperature, fast cure Easy to use Retains softness after cure to contribute to stress relief during thermal cycling Conforms to complex shapes of 3-dimentional interface designs Repairable Flame Retardant:UL94V-0 equivalent Technical Properties Uncured Consistency:Blue Paste Cured Shore Hardness:45 A Thermal Conductivity:4.1 W/mK Thermal Resistance:30 mm2.K/W Dielectric Strength:16 kV/mm Tensile Strength:0.2 Mpa Elongation:40% Operating Temperature:-60°C to +200°C

Momentive TIA241GF is a 2 part, thermally conductive silicone that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, the non-slumping paste consistency of TIA214GF provides physical stability to prevent run-off after dispense.

Recommended for use as a liquid dispensed alternative to pre-fabricated thermal pads and as a gap filler for a broad array of thermal designs in electronic components. Suitable for use in consumer, telecommunications, automotive and lighting electronic component applications.

Product Benefits

  • Good Thermal Conductivity
  • Low temperature, fast cure
  • Easy to use
  • Retains softness after cure to contribute to stress relief during thermal cycling
  • Conforms to complex shapes of 3-dimentional interface designs
  • Repairable
  • Flame Retardant:UL94V-0 equivalent Technical Properties
  • Uncured Consistency:Blue Paste
  • Cured Shore Hardness:45 A
  • Thermal Conductivity:4.1 W/mK
  • Thermal Resistance:30 mm2.K/W
  • Dielectric Strength:16 kV/mm
  • Tensile Strength:0.2 Mpa
  • Elongation:40%
  • Operating Temperature:-60°C to +200°C
Supplier's Site Datasheet

Technical Specifications

  Techsil Limited
Product Category Industrial Adhesives
Product Number MOSI17211
Product Name Momentive TIA241GF Thermal Gap Filler 3.6kg Kit
Chemical System Silicone
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