Momentive TIA241GF is a 2 part, thermally conductive silicone that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, the non-slumping paste consistency of TIA214GF provides physical stability to prevent run-off after dispense.
Recommended for use as a liquid dispensed alternative to pre-fabricated thermal pads and as a gap filler for a broad array of thermal designs in electronic components. Suitable for use in consumer, telecommunications, automotive and lighting electronic component applications.
Product Benefits
Good Thermal Conductivity
Low temperature, fast cure
Easy to use
Retains softness after cure to contribute to stress relief during thermal cycling
Conforms to complex shapes of 3-dimentional interface designs
Repairable
Flame Retardant:UL94V-0 equivalent Technical Properties
Uncured Consistency:Blue Paste
Cured Shore Hardness:45 A
Thermal Conductivity:4.1 W/mK
Thermal Resistance:30 mm2.K/W
Dielectric Strength:16 kV/mm
Tensile Strength:0.2 Mpa
Elongation:40%
Operating Temperature:-60°C to +200°C
Momentive TIA241GF is a 2 part, thermally conductive silicone that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, the non-slumping paste consistency of TIA214GF provides physical stability to prevent run-off after dispense.
Recommended for use as a liquid dispensed alternative to pre-fabricated thermal pads and as a gap filler for a broad array of thermal designs in electronic components. Suitable for use in consumer, telecommunications, automotive and lighting electronic component applications.
Product Benefits
- Good Thermal Conductivity
- Low temperature, fast cure
- Easy to use
- Retains softness after cure to contribute to stress relief during thermal cycling
- Conforms to complex shapes of 3-dimentional interface designs
- Repairable
- Flame Retardant:UL94V-0 equivalent Technical Properties
- Uncured Consistency:Blue Paste
- Cured Shore Hardness:45 A
- Thermal Conductivity:4.1 W/mK
- Thermal Resistance:30 mm2.K/W
- Dielectric Strength:16 kV/mm
- Tensile Strength:0.2 Mpa
- Elongation:40%
- Operating Temperature:-60°C to +200°C
