Momentive TIA350R is a one-component, heat curable silicone adhesive designed for thermally conductive applications. This grade cures quickly upon exposure to heat and adheres well to a wide variety of substrates.
Recommended for use as a thermal interface material between dies and heat spreaders, also suitable for use as an adhesive between various heat sources and heat dissipation devices.
Product Benefits
Good Thermal Conductivity
Low temperature, fast cure
Easy to use
Electrically insulative
Non-corrosive to metals
Primerless adhesion to many substrates
Technical Properties
Uncured Consistency:Grey Paste
Viscosity (@23°C):67 Pa.s
Cured Shore Hardness:72 A
Thermal Conductivity:3.5 W/mK
Thermal Resistance:24 mm2.K/W
Dielectric Strength:20 kV/mm
Tensile Strength:2.2 Mpa
Elongation:30%
Adhesion Strength:1.0 Mpa
Operating Temperature:-40°C to +200°C
Momentive TIA350R is a one-component, heat curable silicone adhesive designed for thermally conductive applications. This grade cures quickly upon exposure to heat and adheres well to a wide variety of substrates.
Recommended for use as a thermal interface material between dies and heat spreaders, also suitable for use as an adhesive between various heat sources and heat dissipation devices.
Product Benefits
- Good Thermal Conductivity
- Low temperature, fast cure
- Easy to use
- Electrically insulative
- Non-corrosive to metals
- Primerless adhesion to many substrates
Technical Properties
- Uncured Consistency:Grey Paste
- Viscosity (@23°C):67 Pa.s
- Cured Shore Hardness:72 A
- Thermal Conductivity:3.5 W/mK
- Thermal Resistance:24 mm2.K/W
- Dielectric Strength:20 kV/mm
- Tensile Strength:2.2 Mpa
- Elongation:30%
- Adhesion Strength:1.0 Mpa
- Operating Temperature:-40°C to +200°C
