TE Connectivity Development Boards, Kits, Programmers - Evaluation Boards - RF Evaluation and Development Kits, Boards MDEV-900-PRC

Description
HUMPRC MASTER DEVELOPMENT SYSTEM
Description
HUMPRC MASTER DEVELOPMENT SYSTEM

Suppliers

Company
Product
Description
Supplier Links
Development Boards, Kits, Programmers - Evaluation Boards - RF Evaluation and Development Kits, Boards - MDEV-900-PRC - Acme Chip Technology Co., Limited
Shenzhen, China
Development Boards, Kits, Programmers - Evaluation Boards - RF Evaluation and Development Kits, Boards
MDEV-900-PRC
Development Boards, Kits, Programmers - Evaluation Boards - RF Evaluation and Development Kits, Boards MDEV-900-PRC
HUMPRC MASTER DEVELOPMENT SYSTEM

HUMPRC MASTER DEVELOPMENT SYSTEM

Supplier's Site

Technical Specifications

  Acme Chip Technology Co., Limited
Product Category IC Interfaces
Product Number MDEV-900-PRC
Product Name Development Boards, Kits, Programmers - Evaluation Boards - RF Evaluation and Development Kits, Boards
Unlock Full Specs
to access all available technical data

Similar Products

 - 54ACTQ244JRQMLV - Rochester Electronics
Specs
Device Type Line / Bus Driver
Package Type DIP; DIP20
View Details
2 suppliers
Interface module - 289-714 - WAGO
Specs
Device Type Sensor Interface
Operating Temperature -20 to 55 C (-4 to 131 F)
View Details
 - 26LS31/B2A - Rochester Electronics
Specs
Technology RS422
Package Type CQCC20
View Details
3 suppliers
Telecom - SI32261-C-ZM2R - Quarktwin Technology Ltd.
Skyworks Solutions, Inc.
Specs
Technology SPI; GCI, PCM, SPI
Features RoHS
Supply Voltage Other; 3.13V ~ 3.47V
View Details