Contact Features Contact Base Material : Copper Contact Current Rating (Max) (AMP) : 200 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : Without Contact Size : Size 0 Contact Type : Socket Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1 MICM [40 MICIN ] Mating Pin Diameter : 9.06 MM [.357 INCH ]
Mechanical Attachment Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Bag Packaging Quantity : 100
Termination Features Product Terminates To : Busbar
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
TE Connectivity
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Datasheet
Description
Contact Features Contact Base Material : Copper Contact Current Rating (Max) (AMP) : 200 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : Without Contact Size : Size 0 Contact Type : Socket Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1 MICM [40 MICIN ] Mating Pin Diameter : 9.06 MM [.357 INCH ]
Mechanical Attachment Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Bag Packaging Quantity : 100
Termination Features Product Terminates To : Busbar
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Contact Features Contact Base Material : Copper Contact Current Rating (Max) (AMP) : 200 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : Without Contact Size : Size 0 Contact Type : Socket Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1 MICM [40 MICIN ] Mating Pin Diameter : 9.06 MM [.357 INCH ]
Mechanical Attachment Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Bag Packaging Quantity : 100
Termination Features Product Terminates To : Busbar
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Contact Features
Contact Base Material : Copper
Contact Current Rating (Max) (AMP) : 200
Contact Mating Area Plating Material : Gold (Au)
Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ]
Contact Orientation : Straight
Contact Retention Within Housing : Without
Contact Size : Size 0
Contact Type : Socket
Contact Underplating Material : Nickel
Contact Underplating Material Thickness : 1 MICM [40 MICIN ]
Mating Pin Diameter : 9.06 MM [.357 INCH ]
Mechanical Attachment
Wire Insulation Support : Without
Operation/Application
Circuit Application : Power
Packaging Features
Packaging Method : Bag
Packaging Quantity : 100
Termination Features
Product Terminates To : Busbar
Usage Conditions
Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
