TE Connectivity
PCB Terminals
63862-2
Description
Contact Features Contact Mating Area Plating Material Thickness : 3.81 MICM [150 MICIN ] Contact Underplating Material : None Contact Underplating Material Thickness : 1.27 MICM [50 MICIN ] Mating Tab Thickness : .81 MM [.032 INCH ] Mating Tab Width : 6.35 MM [.25 INCH ] PCB Contact Termination Area Plating Material Thickness : 3.81 MICM [150 MICIN ] PCB Terminal Type : Tab Terminal Orientation : Straight Terminal Plating Material : Tin Terminal Size : 6.35
Dimensions PCB Hole Diameter : 1.32 MM [.052 INCH ] PCB Thickness (Recommended) : 1.57 MM [.062 INCH ] Profile Height from PCB : 10.21 MM [.402 INCH ]
Packaging Features Packaging Method : Reel Packaging Quantity : 10000
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Insulation Option : Uninsulated Operating Temperature Range : -40 - 110 DEGC [-40 - 230 DEGF ]
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Description
Contact Features Contact Mating Area Plating Material Thickness : 3.81 MICM [150 MICIN ] Contact Underplating Material : None Contact Underplating Material Thickness : 1.27 MICM [50 MICIN ] Mating Tab Thickness : .81 MM [.032 INCH ] Mating Tab Width : 6.35 MM [.25 INCH ] PCB Contact Termination Area Plating Material Thickness : 3.81 MICM [150 MICIN ] PCB Terminal Type : Tab Terminal Orientation : Straight Terminal Plating Material : Tin Terminal Size : 6.35
Dimensions PCB Hole Diameter : 1.32 MM [.052 INCH ] PCB Thickness (Recommended) : 1.57 MM [.062 INCH ] Profile Height from PCB : 10.21 MM [.402 INCH ]
Packaging Features Packaging Method : Reel Packaging Quantity : 10000
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Insulation Option : Uninsulated Operating Temperature Range : -40 - 110 DEGC [-40 - 230 DEGF ]
Request a Quote
Email Supplier
Suppliers
Contact Features Contact Mating Area Plating Material Thickness : 3.81 MICM [150 MICIN ] Contact Underplating Material : None Contact Underplating Material Thickness : 1.27 MICM [50 MICIN ] Mating Tab Thickness : .81 MM [.032 INCH ] Mating Tab Width : 6.35 MM [.25 INCH ] PCB Contact Termination Area Plating Material Thickness : 3.81 MICM [150 MICIN ] PCB Terminal Type : Tab Terminal Orientation : Straight Terminal Plating Material : Tin Terminal Size : 6.35
Dimensions PCB Hole Diameter : 1.32 MM [.052 INCH ] PCB Thickness (Recommended) : 1.57 MM [.062 INCH ] Profile Height from PCB : 10.21 MM [.402 INCH ]
Packaging Features Packaging Method : Reel Packaging Quantity : 10000
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Insulation Option : Uninsulated Operating Temperature Range : -40 - 110 DEGC [-40 - 230 DEGF ]
Contact Features
- Contact Mating Area Plating Material Thickness : 3.81 MICM [150 MICIN ]
- Contact Underplating Material : None
- Contact Underplating Material Thickness : 1.27 MICM [50 MICIN ]
- Mating Tab Thickness : .81 MM [.032 INCH ]
- Mating Tab Width : 6.35 MM [.25 INCH ]
- PCB Contact Termination Area Plating Material Thickness : 3.81 MICM [150 MICIN ]
- PCB Terminal Type : Tab
- Terminal Orientation : Straight
- Terminal Plating Material : Tin
- Terminal Size : 6.35
Dimensions
- PCB Hole Diameter : 1.32 MM [.052 INCH ]
- PCB Thickness (Recommended) : 1.57 MM [.062 INCH ]
- Profile Height from PCB : 10.21 MM [.402 INCH ]
Packaging Features
- Packaging Method : Reel
- Packaging Quantity : 10000
Termination Features
- Product Terminates To : Printed Circuit Board
- Termination Method to PCB : Through Hole - Solder
Usage Conditions
- Insulation Option : Uninsulated
- Operating Temperature Range : -40 - 110 DEGC [-40 - 230 DEGF ]
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Technical Specifications
|
Product Category
|
Wire Terminals |
|
Product Number
|
63862-2 |
|
Product Name
|
PCB Terminals |
|
Material
|
Tin
|
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