Contact Features Contact Base Material : Beryllium Copper Contact Mating Area Plating Material : Tin (Sn) Contact Retention Within Housing : With Contact Type : Socket PCB Contact Termination Area Plating Material : Tin Wire Contact Termination Area Plating Material : Tin-Lead
Dimensions Compatible Insulation Diameter Range : 1.52 - 2.29 MM [.06 - .09 INCH ] Wire Size (MMSQ) : .3 - .9 Wire Size (AWG) : 22 - 18 Wire Size (CMA) : 642 - 1624
Mechanical Attachment Contact Retention Type Within Housing : Locking Lance
Operation/Applicatio
n Circuit Application : Power & Signal
Packaging Features Packaging Method : Strip Packaging Quantity : 4500
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Crimp
TE Connectivity
Heilind Electronics, Inc.
Done
Request a Quote
Email Supplier
Description
Contact Features Contact Base Material : Beryllium Copper Contact Mating Area Plating Material : Tin (Sn) Contact Retention Within Housing : With Contact Type : Socket PCB Contact Termination Area Plating Material : Tin Wire Contact Termination Area Plating Material : Tin-Lead
Dimensions Compatible Insulation Diameter Range : 1.52 - 2.29 MM [.06 - .09 INCH ] Wire Size (MMSQ) : .3 - .9 Wire Size (AWG) : 22 - 18 Wire Size (CMA) : 642 - 1624
Mechanical Attachment Contact Retention Type Within Housing : Locking Lance
Operation/Applicatio
n Circuit Application : Power & Signal
Packaging Features Packaging Method : Strip Packaging Quantity : 4500
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Crimp
Contact Features Contact Base Material : Beryllium Copper Contact Mating Area Plating Material : Tin (Sn) Contact Retention Within Housing : With Contact Type : Socket PCB Contact Termination Area Plating Material : Tin Wire Contact Termination Area Plating Material : Tin-Lead
Dimensions Compatible Insulation Diameter Range : 1.52 - 2.29 MM [.06 - .09 INCH ] Wire Size (MMSQ) : .3 - .9 Wire Size (AWG) : 22 - 18 Wire Size (CMA) : 642 - 1624
Mechanical Attachment Contact Retention Type Within Housing : Locking Lance
Operation/Applicatio
n Circuit Application : Power & Signal
Packaging Features Packaging Method : Strip Packaging Quantity : 4500
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Crimp
Contact Features
Contact Base Material : Beryllium Copper
Contact Mating Area Plating Material : Tin (Sn)
Contact Retention Within Housing : With
Contact Type : Socket
PCB Contact Termination Area Plating Material : Tin
Wire Contact Termination Area Plating Material : Tin-Lead
Dimensions
Compatible Insulation Diameter Range : 1.52 - 2.29 MM [.06 - .09 INCH ]
Wire Size (MMSQ) : .3 - .9
Wire Size (AWG) : 22 - 18
Wire Size (CMA) : 642 - 1624
Mechanical Attachment
Contact Retention Type Within Housing : Locking Lance
