TE ConnectivityWire-to-Board Connector Contacts530004-7
Description
Contact Features Contact Base Material : Beryllium Copper Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 15 Contact Retention Within Housing : With Contact Type : Socket Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Nickel Wire Contact Termination Area Plating Material : Nickel Wire Contact Termination Area Plating Thickness (MICIN) : 150
Dimensions Accepts Insulation Diameter Range : .89 - 1.4 MM [.035 - .055 INCH ] Wire Size (MMSQ) : .12 - .4 Wire Size (AWG) : 26 - 22 Wire Size (CMA) : 254.1 - 642.5
Mechanical Attachment Contact Retention Type Within Housing : Locking Lance
Operation/Applicatio
n Circuit Application : Power & Signal
Packaging Features Packaging Method : Strip Packaging Quantity : 4500
Product Type Features Connector & Contact Terminates To : Wire & Cable Connector System : Wire-to-Board
Termination Features Termination Method to Wire & Cable : Crimp
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Description
Contact Features Contact Base Material : Beryllium Copper Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 15 Contact Retention Within Housing : With Contact Type : Socket Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Nickel Wire Contact Termination Area Plating Material : Nickel Wire Contact Termination Area Plating Thickness (MICIN) : 150
Dimensions Accepts Insulation Diameter Range : .89 - 1.4 MM [.035 - .055 INCH ] Wire Size (MMSQ) : .12 - .4 Wire Size (AWG) : 26 - 22 Wire Size (CMA) : 254.1 - 642.5
Mechanical Attachment Contact Retention Type Within Housing : Locking Lance
Operation/Applicatio
n Circuit Application : Power & Signal
Packaging Features Packaging Method : Strip Packaging Quantity : 4500
Product Type Features Connector & Contact Terminates To : Wire & Cable Connector System : Wire-to-Board
Termination Features Termination Method to Wire & Cable : Crimp
Contact Features Contact Base Material : Beryllium Copper Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness (MICIN) : 15 Contact Retention Within Housing : With Contact Type : Socket Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Nickel Wire Contact Termination Area Plating Material : Nickel Wire Contact Termination Area Plating Thickness (MICIN) : 150
Dimensions Accepts Insulation Diameter Range : .89 - 1.4 MM [.035 - .055 INCH ] Wire Size (MMSQ) : .12 - .4 Wire Size (AWG) : 26 - 22 Wire Size (CMA) : 254.1 - 642.5
Mechanical Attachment Contact Retention Type Within Housing : Locking Lance
Operation/Applicatio
n Circuit Application : Power & Signal
Packaging Features Packaging Method : Strip Packaging Quantity : 4500
Product Type Features Connector & Contact Terminates To : Wire & Cable Connector System : Wire-to-Board
Termination Features Termination Method to Wire & Cable : Crimp
Contact Features
Contact Base Material : Beryllium Copper
Contact Mating Area Plating Material : Gold
Contact Mating Area Plating Material Thickness (MICIN) : 15
Contact Retention Within Housing : With
Contact Type : Socket
Contact Underplating Material : Nickel
PCB Contact Termination Area Plating Material : Nickel
Wire Contact Termination Area Plating Material : Nickel
Wire Contact Termination Area Plating Thickness (MICIN) : 150
Dimensions
Accepts Insulation Diameter Range : .89 - 1.4 MM [.035 - .055 INCH ]
Wire Size (MMSQ) : .12 - .4
Wire Size (AWG) : 26 - 22
Wire Size (CMA) : 254.1 - 642.5
Mechanical Attachment
Contact Retention Type Within Housing : Locking Lance
