Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 3.1 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness (MICIN) : 30 Contact Size : Size 20 Contact Type : Socket Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin
Mechanical Attachment Contact Retention Type Within Housing : Snap-In Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Loose Piece Packaging Quantity : 1000
Termination Features Product Terminates To : Printed Circuit Board Termination Method to Wire & Cable : Solder Termination Post & Tail Length : 10.85 MM [.427 INCH ]
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
TE Connectivity
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Description
Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 3.1 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness (MICIN) : 30 Contact Size : Size 20 Contact Type : Socket Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin
Mechanical Attachment Contact Retention Type Within Housing : Snap-In Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Loose Piece Packaging Quantity : 1000
Termination Features Product Terminates To : Printed Circuit Board Termination Method to Wire & Cable : Solder Termination Post & Tail Length : 10.85 MM [.427 INCH ]
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Contact Features Contact Base Material : Phosphor Bronze Contact Current Rating (Max) (AMP) : 3.1 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness (MICIN) : 30 Contact Size : Size 20 Contact Type : Socket Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin
Mechanical Attachment Contact Retention Type Within Housing : Snap-In Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Loose Piece Packaging Quantity : 1000
Termination Features Product Terminates To : Printed Circuit Board Termination Method to Wire & Cable : Solder Termination Post & Tail Length : 10.85 MM [.427 INCH ]
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Contact Features
Contact Base Material : Phosphor Bronze
Contact Current Rating (Max) (AMP) : 3.1
Contact Mating Area Plating Material : Gold (Au)
Contact Mating Area Plating Material Thickness (MICIN) : 30
Contact Size : Size 20
Contact Type : Socket
Contact Underplating Material : Nickel
PCB Contact Termination Area Plating Material : Tin
Mechanical Attachment
Contact Retention Type Within Housing : Snap-In
Wire Insulation Support : Without
Operation/Application
Circuit Application : Signal
Packaging Features
Packaging Method : Loose Piece
Packaging Quantity : 1000
Termination Features
Product Terminates To : Printed Circuit Board
Termination Method to Wire & Cable : Solder
Termination Post & Tail Length : 10.85 MM [.427 INCH ]
Usage Conditions
Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
