TE Connectivity Busbar Connectors 2361483-1

Body Features

• Bus Bar Contact Plating Material : Gold

Configuration Features

• Mating & Unmating Configuration : Normal
• Number of Positions : 1
• PCB Mount Orientation : Vertical

Contact Features

• Contact Base Material : Copper Alloy
• Contact Current Rating (Max) (AMP) : 200
• Contact Length : 4 MM  [.157 INCH ]
• Contact Mating Area Plating Material Thickness : .76 MICM  [30 MICIN ]
• Contact Shape & Form : Multiple Contact Band/CROWN BAND
• Contact Underplating Material : Nickel
• Contact Underplating Material Thickness : 1.27 MICM  [50 MICIN ]

Dimensions

• Connector Height : 10 MM  [.394 INCH ]
• PCB Thickness (Recommended) : 1.5 - 2 MM  [.06 - .079 INCH ]
• Product Length : 19.5 MM  [.768 INCH ]

Electrical Characteristics

• Operating Voltage (VAC) : 48
• Operating Voltage (VDC) : 48

Industry Standards

• Agency/Standard : UL

Mechanical Attachment

• Bus Bar Mount Orientation : Vertical
• Mating Alignment : With
• Mating Alignment Type : Blindmate
• PCB Mount Retention Type : Solder Pad

Operation/Application

• Circuit Application : Power

Packaging Features

• Packaging Method : Bag & Box

Product Type Features

• Connector & Contact Terminates To : Printed Circuit Board
• Connector & Housing Type : Receptacle
• Connector System : Board-to-Board

Termination Features

• Termination Method to Printed Circuit Board : Surface Mount

Usage Conditions

• Operating Temperature Range (DEGC) : -40 - 105

Contact Gold Power Socket Solder

Contact Gold Power Socket Solder