TE Connectivity Connector Contacts 2327544-4

Contact Features Contact Base Material : Copper Alloy Contact Mating Area Plating Material : Silver (Ag) Contact Mating Area Plating Material Thickness : 8 - 12 MICM  [.315 - .47 MICIN ] Contact Orientation : Straight Contact Type : Socket Contact Underplating Material : Copper Contact Underplating Material Thickness : .5 MICM  [.02 MICIN ] Mating Pin Diameter : 6 MM  [.24 INCH ] Wire Contact Termination Area Plating Material : Silver Operation/Applicatio n Circuit Application : Power Packaging Features Packaging Method : Tray Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Crimp