TE Connectivity
Connector Contacts
2327544-4
Description
Contact Features Contact Base Material : Copper Alloy Contact Mating Area Plating Material : Silver (Ag) Contact Mating Area Plating Material Thickness : 8 - 12 MICM [.315 - .47 MICIN ] Contact Orientation : Straight Contact Type : Socket Contact Underplating Material : Copper Contact Underplating Material Thickness : .5 MICM [.02 MICIN ] Mating Pin Diameter : 6 MM [.24 INCH ] Wire Contact Termination Area Plating Material : Silver
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Tray
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Crimp
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Description
Contact Features Contact Base Material : Copper Alloy Contact Mating Area Plating Material : Silver (Ag) Contact Mating Area Plating Material Thickness : 8 - 12 MICM [.315 - .47 MICIN ] Contact Orientation : Straight Contact Type : Socket Contact Underplating Material : Copper Contact Underplating Material Thickness : .5 MICM [.02 MICIN ] Mating Pin Diameter : 6 MM [.24 INCH ] Wire Contact Termination Area Plating Material : Silver
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Tray
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Crimp
Request a Quote
Email Supplier
Suppliers
Contact Features Contact Base Material : Copper Alloy Contact Mating Area Plating Material : Silver (Ag) Contact Mating Area Plating Material Thickness : 8 - 12 MICM [.315 - .47 MICIN ] Contact Orientation : Straight Contact Type : Socket Contact Underplating Material : Copper Contact Underplating Material Thickness : .5 MICM [.02 MICIN ] Mating Pin Diameter : 6 MM [.24 INCH ] Wire Contact Termination Area Plating Material : Silver
Operation/Applicatio
n Circuit Application : Power
Packaging Features Packaging Method : Tray
Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Crimp
Contact Features
- Contact Base Material : Copper Alloy
- Contact Mating Area Plating Material : Silver (Ag)
- Contact Mating Area Plating Material Thickness : 8 - 12 MICM [.315 - .47 MICIN ]
- Contact Orientation : Straight
- Contact Type : Socket
- Contact Underplating Material : Copper
- Contact Underplating Material Thickness : .5 MICM [.02 MICIN ]
- Mating Pin Diameter : 6 MM [.24 INCH ]
- Wire Contact Termination Area Plating Material : Silver
Operation/Application
- Circuit Application : Power
Packaging Features
Termination Features
- Product Terminates To : Wire & Cable
- Termination Method to Wire & Cable : Crimp
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Technical Specifications
|
Product Category
|
Wire Terminals |
|
Product Number
|
2327544-4 |
|
Product Name
|
Connector Contacts |
|
Features
|
RoHS
|
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