TE Connectivity Connector Contacts 2327544-4

Description
Contact Features Contact Base Material : Copper Alloy Contact Mating Area Plating Material : Silver (Ag) Contact Mating Area Plating Material Thickness : 8 - 12 MICM  [.315 - .47 MICIN ] Contact Orientation : Straight Contact Type : Socket Contact Underplating Material : Copper Contact Underplating Material Thickness : .5 MICM  [.02 MICIN ] Mating Pin Diameter : 6 MM  [.24 INCH ] Wire Contact Termination Area Plating Material : Silver Operation/Applicatio n Circuit Application : Power Packaging Features Packaging Method : Tray Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Crimp
  • Connector Contacts - 2327544-4 - TE Connectivity
    TE Connectivity
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Description
Contact Features Contact Base Material : Copper Alloy Contact Mating Area Plating Material : Silver (Ag) Contact Mating Area Plating Material Thickness : 8 - 12 MICM  [.315 - .47 MICIN ] Contact Orientation : Straight Contact Type : Socket Contact Underplating Material : Copper Contact Underplating Material Thickness : .5 MICM  [.02 MICIN ] Mating Pin Diameter : 6 MM  [.24 INCH ] Wire Contact Termination Area Plating Material : Silver Operation/Applicatio n Circuit Application : Power Packaging Features Packaging Method : Tray Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Crimp
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Suppliers

Company
Product
Description
Supplier Links
Connector Contacts - 2327544-4 - TE Connectivity
TE Connectivity
Berwyn, PA, United States
Connector Contacts
2327544-4
Connector Contacts 2327544-4
Contact Features Contact Base Material : Copper Alloy Contact Mating Area Plating Material : Silver (Ag) Contact Mating Area Plating Material Thickness : 8 - 12 MICM  [.315 - .47 MICIN ] Contact Orientation : Straight Contact Type : Socket Contact Underplating Material : Copper Contact Underplating Material Thickness : .5 MICM  [.02 MICIN ] Mating Pin Diameter : 6 MM  [.24 INCH ] Wire Contact Termination Area Plating Material : Silver Operation/Applicatio n Circuit Application : Power Packaging Features Packaging Method : Tray Termination Features Product Terminates To : Wire & Cable Termination Method to Wire & Cable : Crimp

Contact Features


  • Contact Base Material : Copper Alloy
  • Contact Mating Area Plating Material : Silver (Ag)
  • Contact Mating Area Plating Material Thickness : 8 - 12 MICM  [.315 - .47 MICIN ]
  • Contact Orientation : Straight
  • Contact Type : Socket
  • Contact Underplating Material : Copper
  • Contact Underplating Material Thickness : .5 MICM  [.02 MICIN ]
  • Mating Pin Diameter : 6 MM  [.24 INCH ]
  • Wire Contact Termination Area Plating Material : Silver

Operation/Application


  • Circuit Application : Power

Packaging Features


  • Packaging Method : Tray

Termination Features


  • Product Terminates To : Wire & Cable
  • Termination Method to Wire & Cable : Crimp
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Technical Specifications

  TE Connectivity
Product Category Wire Terminals
Product Number 2327544-4
Product Name Connector Contacts
Features RoHS
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