Contact Features Contact Mating Area Plating Material : Gold (Au) Contact Type : Tab Mating Tab Thickness : .8 MM [.031 INCH ] Mating Tab Width : 3.1 MM [.122 INCH ]
Packaging Features Packaging Method : Box
Termination Features Product Terminates To : Printed Circuit Board
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
TE Connectivity
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Description
Contact Features Contact Mating Area Plating Material : Gold (Au) Contact Type : Tab Mating Tab Thickness : .8 MM [.031 INCH ] Mating Tab Width : 3.1 MM [.122 INCH ]
Packaging Features Packaging Method : Box
Termination Features Product Terminates To : Printed Circuit Board
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Contact Features Contact Mating Area Plating Material : Gold (Au) Contact Type : Tab Mating Tab Thickness : .8 MM [.031 INCH ] Mating Tab Width : 3.1 MM [.122 INCH ]
Packaging Features Packaging Method : Box
Termination Features Product Terminates To : Printed Circuit Board
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Contact Features
Contact Mating Area Plating Material : Gold (Au)
Contact Type : Tab
Mating Tab Thickness : .8 MM [.031 INCH ]
Mating Tab Width : 3.1 MM [.122 INCH ]
Packaging Features
Packaging Method : Box
Termination Features
Product Terminates To : Printed Circuit Board
Usage Conditions
Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
