DIP IC Socket, 18 Number of Positions, Beryllium Copper Contact Material, +105 °C Temperature Range
Solder Tail Dual Leaf (DL) Sockets
Dual Wiping Contacts
Face Wipe Contacts for High Reliability and Constant, Low Resistance
Stackable End-to-End and Side-to-Side (Brickwalling) for High Board Density
Housing Standoffs and Slots Facilitate Board Cleaning
Retention Style Tails or Straight Solder Tails
Designed for Automatic Machine Insertion - DIP-to-Socket or Socket-to-Board (Tube Loaded)
Housing: Glass-Filled Thermoplastic, 94 V-0 Rated, Black
Contacts: Phosphor Bronze or Beryllium Copper with Tin or Gold Plating
DIP IC Socket, 18 Number of Positions, Beryllium Copper Contact Material, +105 °C Temperature Range
- Solder Tail Dual Leaf (DL) Sockets
- Dual Wiping Contacts
- Face Wipe Contacts for High Reliability and Constant, Low Resistance
- Stackable End-to-End and Side-to-Side (Brickwalling) for High Board Density
- Housing Standoffs and Slots Facilitate Board Cleaning
- Retention Style Tails or Straight Solder Tails
- Designed for Automatic Machine Insertion - DIP-to-Socket or Socket-to-Board (Tube Loaded)
- Housing: Glass-Filled Thermoplastic, 94 V-0 Rated, Black
- Contacts: Phosphor Bronze or Beryllium Copper with Tin or Gold Plating
