TE Connectivity ™ Socket, DIP;16Pins;Dual Leaf;Open;Solder Tail;0.31In.;Beryllium Copper;Tin 2-641610-1

Description
Solder Tail Dual Leaf (DL) Sockets Dual Wiping Contacts Face Wipe Contacts for High Reliability and Constant, Low Resistance Stackable End-to-End and Side-to-Side (Brickwalling) for High Board Density Housing Standoffs and Slots Facilitate Board Cleaning Retention Style Tails or Straight Solder Tails Designed for Automatic Machine Insertion - DIP-to-Socket or Socket-to-Board (Tube Loaded) Housing: Glass-Filled Thermoplastic, 94 V-0 Rated, Black Contacts: Phosphor Bronze or Beryllium Copper with Tin or Gold Plating
Description
Solder Tail Dual Leaf (DL) Sockets Dual Wiping Contacts Face Wipe Contacts for High Reliability and Constant, Low Resistance Stackable End-to-End and Side-to-Side (Brickwalling) for High Board Density Housing Standoffs and Slots Facilitate Board Cleaning Retention Style Tails or Straight Solder Tails Designed for Automatic Machine Insertion - DIP-to-Socket or Socket-to-Board (Tube Loaded) Housing: Glass-Filled Thermoplastic, 94 V-0 Rated, Black Contacts: Phosphor Bronze or Beryllium Copper with Tin or Gold Plating

Suppliers

Company
Product
Description
Supplier Links
Socket, DIP;16Pins;Dual Leaf;Open;Solder Tail;0.31In.;Beryllium Copper;Tin - 70084223 - Allied Electronics, Inc.
Fort Worth, TX, USA
Socket, DIP;16Pins;Dual Leaf;Open;Solder Tail;0.31In.;Beryllium Copper;Tin
70084223
Socket, DIP;16Pins;Dual Leaf;Open;Solder Tail;0.31In.;Beryllium Copper;Tin 70084223
Solder Tail Dual Leaf (DL) Sockets Dual Wiping Contacts Face Wipe Contacts for High Reliability and Constant, Low Resistance Stackable End-to-End and Side-to-Side (Brickwalling) for High Board Density Housing Standoffs and Slots Facilitate Board Cleaning Retention Style Tails or Straight Solder Tails Designed for Automatic Machine Insertion - DIP-to-Socket or Socket-to-Board (Tube Loaded) Housing: Glass-Filled Thermoplastic, 94 V-0 Rated, Black Contacts: Phosphor Bronze or Beryllium Copper with Tin or Gold Plating

  • Solder Tail Dual Leaf (DL) Sockets
  • Dual Wiping Contacts
  • Face Wipe Contacts for High Reliability and Constant, Low Resistance
  • Stackable End-to-End and Side-to-Side (Brickwalling) for High Board Density
  • Housing Standoffs and Slots Facilitate Board Cleaning
  • Retention Style Tails or Straight Solder Tails
  • Designed for Automatic Machine Insertion - DIP-to-Socket or Socket-to-Board (Tube Loaded)
  • Housing: Glass-Filled Thermoplastic, 94 V-0 Rated, Black
  • Contacts: Phosphor Bronze or Beryllium Copper with Tin or Gold Plating
Supplier's Site

Technical Specifications

  Allied Electronics, Inc.
Product Category IC Interconnect Components
Product Number 70084223
Product Name Socket, DIP;16Pins;Dual Leaf;Open;Solder Tail;0.31In.;Beryllium Copper;Tin
Product Type IC Socket
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