TE Connectivity ™ Socket, DIP;16Pins;Dual Leaf;Open;Solder Tail;0.31In.;Beryllium Copper;Tin 2-641610-1

Description
Solder Tail Dual Leaf (DL) Sockets Dual Wiping Contacts Face Wipe Contacts for High Reliability and Constant, Low Resistance Stackable End-to-End and Side-to-Side (Brickwalling) for High Board Density Housing Standoffs and Slots Facilitate Board Cleaning Retention Style Tails or Straight Solder Tails Designed for Automatic Machine Insertion - DIP-to-Socket or Socket-to-Board (Tube Loaded) Housing: Glass-Filled Thermoplastic, 94 V-0 Rated, Black Contacts: Phosphor Bronze or Beryllium Copper with Tin or Gold Plating
Description
Solder Tail Dual Leaf (DL) Sockets Dual Wiping Contacts Face Wipe Contacts for High Reliability and Constant, Low Resistance Stackable End-to-End and Side-to-Side (Brickwalling) for High Board Density Housing Standoffs and Slots Facilitate Board Cleaning Retention Style Tails or Straight Solder Tails Designed for Automatic Machine Insertion - DIP-to-Socket or Socket-to-Board (Tube Loaded) Housing: Glass-Filled Thermoplastic, 94 V-0 Rated, Black Contacts: Phosphor Bronze or Beryllium Copper with Tin or Gold Plating

Suppliers

Company
Product
Description
Supplier Links
Socket, DIP;16Pins;Dual Leaf;Open;Solder Tail;0.31In.;Beryllium Copper;Tin - 70084223 - Allied Electronics, Inc.
Fort Worth, TX, USA
Socket, DIP;16Pins;Dual Leaf;Open;Solder Tail;0.31In.;Beryllium Copper;Tin
70084223
Socket, DIP;16Pins;Dual Leaf;Open;Solder Tail;0.31In.;Beryllium Copper;Tin 70084223
Solder Tail Dual Leaf (DL) Sockets Dual Wiping Contacts Face Wipe Contacts for High Reliability and Constant, Low Resistance Stackable End-to-End and Side-to-Side (Brickwalling) for High Board Density Housing Standoffs and Slots Facilitate Board Cleaning Retention Style Tails or Straight Solder Tails Designed for Automatic Machine Insertion - DIP-to-Socket or Socket-to-Board (Tube Loaded) Housing: Glass-Filled Thermoplastic, 94 V-0 Rated, Black Contacts: Phosphor Bronze or Beryllium Copper with Tin or Gold Plating

  • Solder Tail Dual Leaf (DL) Sockets
  • Dual Wiping Contacts
  • Face Wipe Contacts for High Reliability and Constant, Low Resistance
  • Stackable End-to-End and Side-to-Side (Brickwalling) for High Board Density
  • Housing Standoffs and Slots Facilitate Board Cleaning
  • Retention Style Tails or Straight Solder Tails
  • Designed for Automatic Machine Insertion - DIP-to-Socket or Socket-to-Board (Tube Loaded)
  • Housing: Glass-Filled Thermoplastic, 94 V-0 Rated, Black
  • Contacts: Phosphor Bronze or Beryllium Copper with Tin or Gold Plating
Supplier's Site

Technical Specifications

  Allied Electronics, Inc.
Product Category IC Interconnect Components
Product Number 70084223
Product Name Socket, DIP;16Pins;Dual Leaf;Open;Solder Tail;0.31In.;Beryllium Copper;Tin
Product Type IC Socket
Unlock Full Specs
to access all available technical data

Similar Products

Backplane Connector, Header, 90 Position; Product Range Amphenol Communications Solutions - 03M1273 - Newark, An Avnet Company
Specs
Product Type IC Headers
RoHS Compliant RoHS Compliant
Mounting Press-fit / Solderless Technology; Press Fit
View Details
Elastomeric PCB Connectors - ZEBRA® Connector, Gold 8000 - Fujipoly® America Corp.
Specs
Product Type Elastomeric Connectors
Military Standards MIL-STD-202E; MIL-STD-202E, MIL-STD-202E, MIL-STD-202E
Current Rating 0.3500 amps
View Details
Headers & Wire Housings - 102161-5 - Powell Electronics, Inc.
Specs
Product Type IC Headers
View Details
Discrete Sockets - 1730909 - RS Components, Ltd.
RS Components, Ltd.
Specs
Product Type IC Socket
RoHS Compliant RoHS Compliant
Mounting Solder
View Details