Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 200 Contact Mating Area Plating Material : Silver Contact Mating Area Plating Material Thickness : 5 MICM [200 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : Without Contact Size : 0 Contact Type : Pin Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1.27 MICM [50 MICIN ] Mating Pin Diameter : 9.06 MM [.357 INCH ] Wire Contact Termination Area Plating Material : Silver Wire Contact Termination Area Plating Thickness : 5.08 - 7.62 MICM [200 - 300 MICIN ]
Industry Standards Glow Wire Rating : Standard Part - Not Glow Wire
Mechanical Attachment Threaded Mount Type : 1/4 Probe-Proof Internal Thread Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Other Comment : Use only with probe-proof socket contacts
Packaging Features Packaging Method : Bag Packaging Quantity : 50
Product Type Features Connector & Contact Terminates To : Bus Bar Connector System : Wire-to-Panel Power Contact Type : Contact
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
TE Connectivity
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Description
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 200 Contact Mating Area Plating Material : Silver Contact Mating Area Plating Material Thickness : 5 MICM [200 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : Without Contact Size : 0 Contact Type : Pin Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1.27 MICM [50 MICIN ] Mating Pin Diameter : 9.06 MM [.357 INCH ] Wire Contact Termination Area Plating Material : Silver Wire Contact Termination Area Plating Thickness : 5.08 - 7.62 MICM [200 - 300 MICIN ]
Industry Standards Glow Wire Rating : Standard Part - Not Glow Wire
Mechanical Attachment Threaded Mount Type : 1/4 Probe-Proof Internal Thread Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Other Comment : Use only with probe-proof socket contacts
Packaging Features Packaging Method : Bag Packaging Quantity : 50
Product Type Features Connector & Contact Terminates To : Bus Bar Connector System : Wire-to-Panel Power Contact Type : Contact
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 200 Contact Mating Area Plating Material : Silver Contact Mating Area Plating Material Thickness : 5 MICM [200 MICIN ] Contact Orientation : Straight Contact Retention Within Housing : Without Contact Size : 0 Contact Type : Pin Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1.27 MICM [50 MICIN ] Mating Pin Diameter : 9.06 MM [.357 INCH ] Wire Contact Termination Area Plating Material : Silver Wire Contact Termination Area Plating Thickness : 5.08 - 7.62 MICM [200 - 300 MICIN ]
Industry Standards Glow Wire Rating : Standard Part - Not Glow Wire
Mechanical Attachment Threaded Mount Type : 1/4 Probe-Proof Internal Thread Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power
Other Comment : Use only with probe-proof socket contacts
Packaging Features Packaging Method : Bag Packaging Quantity : 50
Product Type Features Connector & Contact Terminates To : Bus Bar Connector System : Wire-to-Panel Power Contact Type : Contact
Usage Conditions Operating Temperature Range : -55 - 105 DEGC [-67 - 221 DEGF ]
Contact Features
Contact Base Material : Copper Alloy
Contact Current Rating (Max) (AMP) : 200
Contact Mating Area Plating Material : Silver
Contact Mating Area Plating Material Thickness : 5 MICM [200 MICIN ]
Contact Orientation : Straight
Contact Retention Within Housing : Without
Contact Size : 0
Contact Type : Pin
Contact Underplating Material : Nickel
Contact Underplating Material Thickness : 1.27 MICM [50 MICIN ]
Mating Pin Diameter : 9.06 MM [.357 INCH ]
Wire Contact Termination Area Plating Material : Silver
