TE Connectivity
PCB Terminals
1217183-1
Description
Contact Features Contact Mating Area Plating Material Thickness : 2.54 - 5.08 MICM [100 - 200 MICIN ] Contact Underplating Material : Brass Contact Underplating Material Thickness : 2.54 MICM [100 MICIN ] Mating Tab Thickness : .64 MM [.025 INCH ] Mating Tab Width : 1.7 MM [.067 INCH ] PCB Contact Termination Area Plating Material Thickness : 2.54 - 5.08 MICM [100 - 200 MICIN ] PCB Terminal Type : Tab Terminal Orientation : Right Angle Terminal Plating Material : Tin
Dimensions Extension Below Board : 3.86 MM [.152 INCH ] PCB Thickness (Recommended) : 1.57 - 2.36 MM [.062 - .093 INCH ] Profile Height from PCB : 4.34 MM [.173 INCH ] Terminal Material Thickness : .64 MM [.025 INCH ]
Packaging Features Packaging Method : Reel Packaging Quantity : 4000
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Insulation Option : Uninsulated
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Description
Contact Features Contact Mating Area Plating Material Thickness : 2.54 - 5.08 MICM [100 - 200 MICIN ] Contact Underplating Material : Brass Contact Underplating Material Thickness : 2.54 MICM [100 MICIN ] Mating Tab Thickness : .64 MM [.025 INCH ] Mating Tab Width : 1.7 MM [.067 INCH ] PCB Contact Termination Area Plating Material Thickness : 2.54 - 5.08 MICM [100 - 200 MICIN ] PCB Terminal Type : Tab Terminal Orientation : Right Angle Terminal Plating Material : Tin
Dimensions Extension Below Board : 3.86 MM [.152 INCH ] PCB Thickness (Recommended) : 1.57 - 2.36 MM [.062 - .093 INCH ] Profile Height from PCB : 4.34 MM [.173 INCH ] Terminal Material Thickness : .64 MM [.025 INCH ]
Packaging Features Packaging Method : Reel Packaging Quantity : 4000
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Insulation Option : Uninsulated
Request a Quote
Email Supplier
Suppliers
Contact Features Contact Mating Area Plating Material Thickness : 2.54 - 5.08 MICM [100 - 200 MICIN ] Contact Underplating Material : Brass Contact Underplating Material Thickness : 2.54 MICM [100 MICIN ] Mating Tab Thickness : .64 MM [.025 INCH ] Mating Tab Width : 1.7 MM [.067 INCH ] PCB Contact Termination Area Plating Material Thickness : 2.54 - 5.08 MICM [100 - 200 MICIN ] PCB Terminal Type : Tab Terminal Orientation : Right Angle Terminal Plating Material : Tin
Dimensions Extension Below Board : 3.86 MM [.152 INCH ] PCB Thickness (Recommended) : 1.57 - 2.36 MM [.062 - .093 INCH ] Profile Height from PCB : 4.34 MM [.173 INCH ] Terminal Material Thickness : .64 MM [.025 INCH ]
Packaging Features Packaging Method : Reel Packaging Quantity : 4000
Termination Features Product Terminates To : Printed Circuit Board Termination Method to PCB : Through Hole - Solder
Usage Conditions Insulation Option : Uninsulated
Contact Features
- Contact Mating Area Plating Material Thickness : 2.54 - 5.08 MICM [100 - 200 MICIN ]
- Contact Underplating Material : Brass
- Contact Underplating Material Thickness : 2.54 MICM [100 MICIN ]
- Mating Tab Thickness : .64 MM [.025 INCH ]
- Mating Tab Width : 1.7 MM [.067 INCH ]
- PCB Contact Termination Area Plating Material Thickness : 2.54 - 5.08 MICM [100 - 200 MICIN ]
- PCB Terminal Type : Tab
- Terminal Orientation : Right Angle
- Terminal Plating Material : Tin
Dimensions
- Extension Below Board : 3.86 MM [.152 INCH ]
- PCB Thickness (Recommended) : 1.57 - 2.36 MM [.062 - .093 INCH ]
- Profile Height from PCB : 4.34 MM [.173 INCH ]
- Terminal Material Thickness : .64 MM [.025 INCH ]
Packaging Features
- Packaging Method : Reel
- Packaging Quantity : 4000
Termination Features
- Product Terminates To : Printed Circuit Board
- Termination Method to PCB : Through Hole - Solder
Usage Conditions
- Insulation Option : Uninsulated
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Technical Specifications
|
Product Category
|
Wire Terminals |
|
Product Number
|
1217183-1 |
|
Product Name
|
PCB Terminals |
|
Material
|
Tin
|
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