Contact Features Contact Base Material : Beryllium Copper Contact Current Rating (Max) (AMP) : 3 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ] Contact Orientation : Straight Contact Type : Socket PCB Contact Termination Area Plating Material : Gold PCB Contact Termination Area Plating Material Thickness : .127 MICM [5 MICIN ]
Mechanical Attachment PCB Mount Retention : With PCB Mount Retention Type : Action/Compliant Tail Wire Insulation Support : Without
Packaging Features Packaging Method : Package Packaging Quantity : 600
Termination Features Product Terminates To : Printed Circuit Board Termination Method to Printed Circuit Board : Through Hole - Press-Fit Termination Post & Tail Length : 12.7 MM [.5 INCH ]
Usage Conditions Operating Temperature Range (DEGC) : -55 - 105
TE Connectivity
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Description
Contact Features Contact Base Material : Beryllium Copper Contact Current Rating (Max) (AMP) : 3 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ] Contact Orientation : Straight Contact Type : Socket PCB Contact Termination Area Plating Material : Gold PCB Contact Termination Area Plating Material Thickness : .127 MICM [5 MICIN ]
Mechanical Attachment PCB Mount Retention : With PCB Mount Retention Type : Action/Compliant Tail Wire Insulation Support : Without
Packaging Features Packaging Method : Package Packaging Quantity : 600
Termination Features Product Terminates To : Printed Circuit Board Termination Method to Printed Circuit Board : Through Hole - Press-Fit Termination Post & Tail Length : 12.7 MM [.5 INCH ]
Usage Conditions Operating Temperature Range (DEGC) : -55 - 105
Contact Features Contact Base Material : Beryllium Copper Contact Current Rating (Max) (AMP) : 3 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ] Contact Orientation : Straight Contact Type : Socket PCB Contact Termination Area Plating Material : Gold PCB Contact Termination Area Plating Material Thickness : .127 MICM [5 MICIN ]
Mechanical Attachment PCB Mount Retention : With PCB Mount Retention Type : Action/Compliant Tail Wire Insulation Support : Without
Packaging Features Packaging Method : Package Packaging Quantity : 600
Termination Features Product Terminates To : Printed Circuit Board Termination Method to Printed Circuit Board : Through Hole - Press-Fit Termination Post & Tail Length : 12.7 MM [.5 INCH ]
Usage Conditions Operating Temperature Range (DEGC) : -55 - 105
Contact Features
Contact Base Material : Beryllium Copper
Contact Current Rating (Max) (AMP) : 3
Contact Mating Area Plating Material : Gold
Contact Mating Area Plating Material Thickness : 1.27 MICM [50 MICIN ]
Contact Orientation : Straight
Contact Type : Socket
PCB Contact Termination Area Plating Material : Gold
PCB Contact Termination Area Plating Material Thickness : .127 MICM [5 MICIN ]
Mechanical Attachment
PCB Mount Retention : With
PCB Mount Retention Type : Action/Compliant Tail
Wire Insulation Support : Without
Packaging Features
Packaging Method : Package
Packaging Quantity : 600
Termination Features
Product Terminates To : Printed Circuit Board
Termination Method to Printed Circuit Board : Through Hole - Press-Fit
Termination Post & Tail Length : 12.7 MM [.5 INCH ]
