Contact Features Contact Base Material : Brass Contact Mating Area Plating Material : Tin Contact Mating Area Plating Material Thickness : 2.54 - 5.08 MICM [100 - 200 MICIN ] Contact Orientation : Straight Contact Type : Tab Contact Underplating Material : Copper Mating Tab Thickness : .8 MM [.03 INCH ] Mating Tab Width : 1.6 MM [.062 INCH ] PCB Contact Termination Area Plating Material : Tin PCB Contact Termination Area Plating Material Thickness : 2.54 MICM [100 - 200 MICIN ] Wire Contact Termination Area Plating Material : Tin
Dimensions Wire Size (MMSQ) : 5 - 6 Wire Size (AWG) : 10
Mechanical Attachment Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power & Signal
Packaging Features Packaging Method : Reel Packaging Quantity : 20000
Termination Features Product Terminates To : Wire & Cable Termination Method to Printed Circuit Board : Through Hole - Solder
TE Connectivity
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Description
Contact Features Contact Base Material : Brass Contact Mating Area Plating Material : Tin Contact Mating Area Plating Material Thickness : 2.54 - 5.08 MICM [100 - 200 MICIN ] Contact Orientation : Straight Contact Type : Tab Contact Underplating Material : Copper Mating Tab Thickness : .8 MM [.03 INCH ] Mating Tab Width : 1.6 MM [.062 INCH ] PCB Contact Termination Area Plating Material : Tin PCB Contact Termination Area Plating Material Thickness : 2.54 MICM [100 - 200 MICIN ] Wire Contact Termination Area Plating Material : Tin
Dimensions Wire Size (MMSQ) : 5 - 6 Wire Size (AWG) : 10
Mechanical Attachment Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power & Signal
Packaging Features Packaging Method : Reel Packaging Quantity : 20000
Termination Features Product Terminates To : Wire & Cable Termination Method to Printed Circuit Board : Through Hole - Solder
Contact Features Contact Base Material : Brass Contact Mating Area Plating Material : Tin Contact Mating Area Plating Material Thickness : 2.54 - 5.08 MICM [100 - 200 MICIN ] Contact Orientation : Straight Contact Type : Tab Contact Underplating Material : Copper Mating Tab Thickness : .8 MM [.03 INCH ] Mating Tab Width : 1.6 MM [.062 INCH ] PCB Contact Termination Area Plating Material : Tin PCB Contact Termination Area Plating Material Thickness : 2.54 MICM [100 - 200 MICIN ] Wire Contact Termination Area Plating Material : Tin
Dimensions Wire Size (MMSQ) : 5 - 6 Wire Size (AWG) : 10
Mechanical Attachment Wire Insulation Support : Without
Operation/Applicatio
n Circuit Application : Power & Signal
Packaging Features Packaging Method : Reel Packaging Quantity : 20000
Termination Features Product Terminates To : Wire & Cable Termination Method to Printed Circuit Board : Through Hole - Solder
Contact Features
Contact Base Material : Brass
Contact Mating Area Plating Material : Tin
Contact Mating Area Plating Material Thickness : 2.54 - 5.08 MICM [100 - 200 MICIN ]
Contact Orientation : Straight
Contact Type : Tab
Contact Underplating Material : Copper
Mating Tab Thickness : .8 MM [.03 INCH ]
Mating Tab Width : 1.6 MM [.062 INCH ]
PCB Contact Termination Area Plating Material : Tin
PCB Contact Termination Area Plating Material Thickness : 2.54 MICM [100 - 200 MICIN ]
Wire Contact Termination Area Plating Material : Tin
Dimensions
Wire Size (MMSQ) : 5 - 6
Wire Size (AWG) : 10
Mechanical Attachment
Wire Insulation Support : Without
Operation/Application
Circuit Application : Power & Signal
Packaging Features
Packaging Method : Reel
Packaging Quantity : 20000
Termination Features
Product Terminates To : Wire & Cable
Termination Method to Printed Circuit Board : Through Hole - Solder
