Contact Features Contact Base Material : Beryllium Copper Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .508 MICM [20 MICIN ] Contact Orientation : Right Angle Contact Type : Socket Contact Underplating Material : Tin Mating Square Post Dimension : 1.14 MM [.045 INCH ] Wire Contact Termination Area Plating Material : Tin-Lead Wire Contact Termination Area Plating Material Thickness : 1.27 MICM [50 MICIN ]
Mechanical Attachment Wire Insulation Support : With
Operation/Applicatio
n Circuit Application : Signal
Other For Use With : .100 [2.54] Centerline
Packaging Features Packaging Method : Loose Piece Packaging Quantity : 1
Product Type Features Connector & Contact Terminates To : Wire & Cable Connector System : Wire-to-Wire Latch Style : Double Power Contact Type : Contact
Termination Features Square Termination Post & Tail Dimension : 1.14 MM [.045 INCH ] Termination Method to Wire & Cable : Wire Wrap Terminations per Post : 1 High
TE Connectivity
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Description
Contact Features Contact Base Material : Beryllium Copper Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .508 MICM [20 MICIN ] Contact Orientation : Right Angle Contact Type : Socket Contact Underplating Material : Tin Mating Square Post Dimension : 1.14 MM [.045 INCH ] Wire Contact Termination Area Plating Material : Tin-Lead Wire Contact Termination Area Plating Material Thickness : 1.27 MICM [50 MICIN ]
Mechanical Attachment Wire Insulation Support : With
Operation/Applicatio
n Circuit Application : Signal
Other For Use With : .100 [2.54] Centerline
Packaging Features Packaging Method : Loose Piece Packaging Quantity : 1
Product Type Features Connector & Contact Terminates To : Wire & Cable Connector System : Wire-to-Wire Latch Style : Double Power Contact Type : Contact
Termination Features Square Termination Post & Tail Dimension : 1.14 MM [.045 INCH ] Termination Method to Wire & Cable : Wire Wrap Terminations per Post : 1 High
Contact Features Contact Base Material : Beryllium Copper Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .508 MICM [20 MICIN ] Contact Orientation : Right Angle Contact Type : Socket Contact Underplating Material : Tin Mating Square Post Dimension : 1.14 MM [.045 INCH ] Wire Contact Termination Area Plating Material : Tin-Lead Wire Contact Termination Area Plating Material Thickness : 1.27 MICM [50 MICIN ]
Mechanical Attachment Wire Insulation Support : With
Operation/Applicatio
n Circuit Application : Signal
Other For Use With : .100 [2.54] Centerline
Packaging Features Packaging Method : Loose Piece Packaging Quantity : 1
Product Type Features Connector & Contact Terminates To : Wire & Cable Connector System : Wire-to-Wire Latch Style : Double Power Contact Type : Contact
Termination Features Square Termination Post & Tail Dimension : 1.14 MM [.045 INCH ] Termination Method to Wire & Cable : Wire Wrap Terminations per Post : 1 High
Contact Features
Contact Base Material : Beryllium Copper
Contact Mating Area Plating Material : Gold
Contact Mating Area Plating Material Thickness : .508 MICM [20 MICIN ]
Contact Orientation : Right Angle
Contact Type : Socket
Contact Underplating Material : Tin
Mating Square Post Dimension : 1.14 MM [.045 INCH ]
Wire Contact Termination Area Plating Material : Tin-Lead
Wire Contact Termination Area Plating Material Thickness : 1.27 MICM [50 MICIN ]
Mechanical Attachment
Wire Insulation Support : With
Operation/Application
Circuit Application : Signal
Other
For Use With : .100 [2.54] Centerline
Packaging Features
Packaging Method : Loose Piece
Packaging Quantity : 1
Product Type Features
Connector & Contact Terminates To : Wire & Cable
Connector System : Wire-to-Wire
Latch Style : Double
Power Contact Type : Contact
Termination Features
Square Termination Post & Tail Dimension : 1.14 MM [.045 INCH ]
