T-Global Technology Co., Ltd. Gap Filler, 1X150Mm Sq; Insulator Body Material T Global H482-150-1.0A

Description
GAP FILLER, 1X150MM SQ; Insulator Body Material:-; Thermal Conductivity:2.2W/m. K; Breakdown Voltage Vbr:-; Thickness:1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:H482 Series; SVHC:No SVHC RoHS Compliant: Yes
  • Gap Filler, 1X150Mm Sq; Insulator Body Material T Global - 53M7861 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
GAP FILLER, 1X150MM SQ; Insulator Body Material:-; Thermal Conductivity:2.2W/m. K; Breakdown Voltage Vbr:-; Thickness:1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:H482 Series; SVHC:No SVHC RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Gap Filler, 1X150Mm Sq; Insulator Body Material T Global - 53M7861 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Gap Filler, 1X150Mm Sq; Insulator Body Material T Global
53M7861
Gap Filler, 1X150Mm Sq; Insulator Body Material T Global 53M7861
GAP FILLER, 1X150MM SQ; Insulator Body Material:-; Thermal Conductivity:2.2W/m. K; Breakdown Voltage Vbr:-; Thickness:1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:H482 Series; SVHC:No SVHC RoHS Compliant: Yes

GAP FILLER, 1X150MM SQ; Insulator Body Material:-; Thermal Conductivity:2.2W/m.K; Breakdown Voltage Vbr:-; Thickness:1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:H482 Series; SVHC:No SVHC RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 53M7861
Product Name Gap Filler, 1X150Mm Sq; Insulator Body Material T Global
Thermal Conductivity 2.2 W/m-K (1.27 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Thermal Interface Materials - - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Thermal Interface Materials
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity - EP3HTSDA-1 - Master Bond, Inc.
Master Bond, Inc.
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity
EP3HTSDA-1
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Liquid; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
View Details
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D - 745D - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D
745D
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
High-performance insulation sheets for power semiconductors - SC800-PI-2-K10 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
High-performance insulation sheets for power semiconductors
SC800-PI-2-K10
Specs
Chemical System Silicone
Industry Electronics
Use Temperature -58 to 392 F (-50 to 200 C)
View Details