Qnnect, formerly Hermetic Solutions Group has extensive experience in manufacturing power packaging, including high thermal dissipation power packages and power transistor outline packages. We have the largest selection of open tooling, plus custom capabilities for any size package and application.
| Qnnect, formerly Hermetic Solutions Group | |
|---|---|
| Product Category | Electronic Packages and Lids |
| Product Name | Power Packages |
| Package Material | Copper, Copper Tungsten, Copper Moly, GlidCop, Al/Si, Copper Graphite and Graphite Diamond |
