Molex Signal Tech Industrial Ltd.CEA Series: Data Transfer Rectangular Connectors
Description
Features & Benefits
Offset grid contact layout, one or two contact rows within dielectric connector body
5.08mm center-to-center contact spacing in each row and 5.08mm row-to-row spacing if applicable
1.5mm nominal pin DIA contact size; 3,5 and 9 contact positions
Hand solder, dip solder and crimp termination styles.
Molex Signal Tech Industrial Ltd.
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Description
Features & Benefits
Offset grid contact layout, one or two contact rows within dielectric connector body
5.08mm center-to-center contact spacing in each row and 5.08mm row-to-row spacing if applicable
1.5mm nominal pin DIA contact size; 3,5 and 9 contact positions
Hand solder, dip solder and crimp termination styles.
Features & Benefits
Offset grid contact layout, one or two contact rows within dielectric connector body
5.08mm center-to-center contact spacing in each row and 5.08mm row-to-row spacing if applicable
1.5mm nominal pin DIA contact size; 3,5 and 9 contact positions
Hand solder, dip solder and crimp termination styles.
Features & Benefits
Offset grid contact layout, one or two contact rows within dielectric connector body
5.08mm center-to-center contact spacing in each row and 5.08mm row-to-row spacing if applicable
1.5mm nominal pin DIA contact size; 3,5 and 9 contact positions
Hand solder, dip solder and crimp termination styles.
