MacDermid Alpha Electronics Solutions Copper Adhesion Promoters for IC Substrates MultiBond 500

Product Overview MultiBond 500 is a first-generation, low-etch oxide alternative designed for laser direct drill pretreatment and reliable innerlayer adhesion in multilayer circuit boards, specifically for Semi-Additive Process (SAP) and Modified Semi-Additive Process (mSAP) applications. Due to its lower etch depth and lower roughness profile, the MultiBond 500 process enhances laser direct drilling of vias while providing optimized topography to meet the most demanding adhesion requirements. Product Features High Uniformity The MultiBond 500 process results in a uniform dark brown coating with finely etched copper topography, with only 0.5 µm of copper removal. Excellent Adhesion Promotion The resulting copper surface is ideal for laser direct drilling on thin copper foils and provides excellent adhesion to a wide range of resin systems, enhancing reliability. Reduce Waste Treatment The combination of low etch and high solution copper capacity results in reduced waste treatment volume. Featured Applications mSAP and SAP MultiBond 500 removes only 0.5 µm of copper for mSAP and SAP applications, as well as controlled impedance designs.