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Sensata Technologies 773 Series CSP/FBGA Devices

Description
0.4mm pitch Compression surface mount High performance/low cost achieved through use of carrier loaded stamped contact Z-axis compliant buckle beam contact supports any type of solder ball
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Suppliers

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Product
Description
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773 Series CSP/FBGA Devices -  - Sensata Technologies
Attleboro, MA, USA
773 Series CSP/FBGA Devices
773 Series CSP/FBGA Devices
0.4mm pitch Compression surface mount High performance/low cost achieved through use of carrier loaded stamped contact Z-axis compliant buckle beam contact supports any type of solder ball
  • 0.4mm pitch
  • Compression surface mount
  • High performance/low cost achieved through use of carrier loaded stamped contact
  • Z-axis compliant buckle beam contact supports any type of solder ball
Supplier's Site Datasheet

Technical Specifications

  Sensata Technologies
Product Category IC Interconnect Components
Product Name 773 Series CSP/FBGA Devices
Product Type IC Socket
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