Rochester Electronics Memory - Unclassified Memory - AM27S45APC AM27S45APC

Description
Manufacturer: Advanced Micro Devices Win Source Part Number: 860913-AM27S45APC Operating Temperature Range: 0°C ~ 75°C (TA) Features: - Memory IC 16Kb (2K x 8) Parallel 24-PDIP Package: Bulk Package: 24-DIP (0.300", 7.62mm) Mounting: Through Hole Categories: Integrated Circuits (ICs) Case / Package: 24-PDIP ECCN: EAR99 Popularity: Medium Fake Threat In the Open Market: 62 pct. Supply and Demand Status: Limited Quantity per package: 1 MSL Level: 3 (168 Hours) REACH Status: Vendor Undefined HTSUS: 8542.32.0071
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Description
Manufacturer: Advanced Micro Devices Win Source Part Number: 860913-AM27S45APC Operating Temperature Range: 0°C ~ 75°C (TA) Features: - Memory IC 16Kb (2K x 8) Parallel 24-PDIP Package: Bulk Package: 24-DIP (0.300", 7.62mm) Mounting: Through Hole Categories: Integrated Circuits (ICs) Case / Package: 24-PDIP ECCN: EAR99 Popularity: Medium Fake Threat In the Open Market: 62 pct. Supply and Demand Status: Limited Quantity per package: 1 MSL Level: 3 (168 Hours) REACH Status: Vendor Undefined HTSUS: 8542.32.0071
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Suppliers

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Memory - Unclassified Memory - AM27S45APC - 860913-AM27S45APC - Win Source Electronics
Laguna Hills, CA, United States
Memory - Unclassified Memory - AM27S45APC
860913-AM27S45APC
Memory - Unclassified Memory - AM27S45APC 860913-AM27S45APC
Manufacturer: Advanced Micro Devices Win Source Part Number: 860913-AM27S45APC Operating Temperature Range: 0°C ~ 75°C (TA) Features: - Memory IC 16Kb (2K x 8) Parallel 24-PDIP Package: Bulk Package: 24-DIP (0.300", 7.62mm) Mounting: Through Hole Categories: Integrated Circuits (ICs) Case / Package: 24-PDIP ECCN: EAR99 Popularity: Medium Fake Threat In the Open Market: 62 pct. Supply and Demand Status: Limited Quantity per package: 1 MSL Level: 3 (168 Hours) REACH Status: Vendor Undefined HTSUS: 8542.32.0071

Manufacturer: Advanced Micro Devices
Win Source Part Number: 860913-AM27S45APC
Operating Temperature Range: 0°C ~ 75°C (TA)
Features: - Memory IC 16Kb (2K x 8) Parallel 24-PDIP
Package: Bulk
Package: 24-DIP (0.300", 7.62mm)
Mounting: Through Hole
Categories: Integrated Circuits (ICs)
Case / Package: 24-PDIP
ECCN: EAR99
Popularity: Medium
Fake Threat In the Open Market: 62 pct.
Supply and Demand Status: Limited
Quantity per package: 1
MSL Level: 3 (168 Hours)
REACH Status: Vendor Undefined
HTSUS: 8542.32.0071

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AM27S45 - OTP ROM, 2KX8

AM27S45 - OTP ROM, 2KX8

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Technical Specifications

  Win Source Electronics Lingto Electronic Limited
Product Category Memory Chips Memory Chips
Product Number 860913-AM27S45APC AM27S45APC
Product Name Memory - Unclassified Memory - AM27S45APC Memory
Operating Temperature 0 to 75 C (32 to 167 F)
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