Renesas Electronics Corporation Interface - Sensor and Detector Interfaces ZSSC3136BA1D

Description
DICE (WAFER SAWN) - WAFFLE PACK
  • Interface - Sensor and Detector Interfaces - ZSSC3136BA1D - Lingto Electronic Limited
    Lingto Electronic Limited
Datasheet
Description
DICE (WAFER SAWN) - WAFFLE PACK
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Interface - Sensor and Detector Interfaces - ZSSC3136BA1D - Lingto Electronic Limited
Lingto Electronic Limited
Shenzhen, China
Interface - Sensor and Detector Interfaces
ZSSC3136BA1D
Interface - Sensor and Detector Interfaces ZSSC3136BA1D
DICE (WAFER SAWN) - WAFFLE PACK

DICE (WAFER SAWN) - WAFFLE PACK

Supplier's Site Datasheet

Technical Specifications

  Lingto Electronic Limited
Product Category IC Interfaces
Product Number ZSSC3136BA1D
Product Name Interface - Sensor and Detector Interfaces
Device Type Sensor Interface
Unlock Full Specs
to access all available technical data

Similar Products

Type 38.21 - Timed interface modules - EMR & SSR - 382100480060 - Finder S.p.A. con unico socio
Finder S.p.A. con unico socio
Type 38.21 - Timed interface modules - EMR & SSR
382100480060
Specs
Device Type Sensor Interface
View Details
Interface - Specialized - AD9882AKSTZ-100 - Lingto Electronic Limited
Rochester Electronics
Interface - Specialized
AD9882AKSTZ-100
Specs
Technology DVI; Analog, DVI
Device Type Sensor Interface
Package Type QFP; 100-LQFP
View Details
- 2EDN8524RXUMA1 - Rochester Electronics
Infineon Technologies AG
2EDN8524RXUMA1
Specs
Device Type Buffer
Features RoHS
Package Type SOP; SSOP; TSSOP; PG-TSSOP-8
View Details
DS26C32AMQML CMOS Quad Differential Line Receivers - 5962-9164001MFA - Texas Instruments
Texas Instruments
DS26C32AMQML CMOS Quad Differential Line Receivers
5962-9164001MFA
Specs
Device Type Receiver
Operating Temperature -55 to 125 C (-67 to 257 F)
Package Type CDIP,CFP,LCCC
View Details