Renesas Electronics Corporation Sensor and Detector Interfaces ZSC31150GAC

Description
DICE (WAFER SAWN) - FRAME
Request a Quote Datasheet
Description
DICE (WAFER SAWN) - FRAME
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Sensor and Detector Interfaces - ZSC31150GAC - ODG (Origin Data Global)
Shenzhen, China
Sensor and Detector Interfaces
ZSC31150GAC
Sensor and Detector Interfaces ZSC31150GAC
DICE (WAFER SAWN) - FRAME

DICE (WAFER SAWN) - FRAME

Supplier's Site Datasheet
Interface - Sensor and Detector Interfaces - ZSC31150GAC - Lingto Electronic Limited
Shenzhen, China
Interface - Sensor and Detector Interfaces
ZSC31150GAC
Interface - Sensor and Detector Interfaces ZSC31150GAC
DICE (WAFER SAWN) - FRAME

DICE (WAFER SAWN) - FRAME

Supplier's Site Datasheet

Technical Specifications

  ODG (Origin Data Global) Lingto Electronic Limited
Product Category IC Interfaces IC Interfaces
Product Number ZSC31150GAC ZSC31150GAC
Product Name Sensor and Detector Interfaces Interface - Sensor and Detector Interfaces
Device Type Sensor Interface
Unlock Full Specs
to access all available technical data

Similar Products

 - 9519ADC - Rochester Electronics
Specs
Package Type DIP; CDIP; CDIP28
View Details
2 suppliers
 - 74ABT162245ADL,118 - Rochester Electronics
Specs
Device Type Transceiver
Features RoHS
Package Type SOP; SSOP; SSOP48
View Details
RF Front End (LNA + PA) - 2312-QPF4656SRTR-ND - DigiKey
Specs
Device Type Front End
Package Type 16-SMD Module
Pins 16 #
View Details