Renesas Electronics Corporation Interface - Sensor and Detector Interfaces ZSC31014EID

Description
DICE (WAFER SAWN) - WAFFLE PACK
Datasheet
Description
DICE (WAFER SAWN) - WAFFLE PACK
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Interface - Sensor and Detector Interfaces - ZSC31014EID - Lingto Electronic Limited
Shenzhen, China
Interface - Sensor and Detector Interfaces
ZSC31014EID
Interface - Sensor and Detector Interfaces ZSC31014EID
DICE (WAFER SAWN) - WAFFLE PACK

DICE (WAFER SAWN) - WAFFLE PACK

Supplier's Site Datasheet

Technical Specifications

  Lingto Electronic Limited
Product Category IC Interfaces
Product Number ZSC31014EID
Product Name Interface - Sensor and Detector Interfaces
Device Type Sensor Interface
Unlock Full Specs
to access all available technical data

Similar Products

RF Front End (LNA + PA) - 2312-QPF4550SRDKR-ND - DigiKey
Specs
Device Type Front End
Package Type 16-QFN
Pins 16 #
View Details
Type 38.21 - Timed interface modules - EMR & SSR - 382100120060 - Finder S.p.A. con unico socio
Specs
Device Type Sensor Interface
View Details
Quad buffer/line driver; 3-state - 74AHCT126BQ-Q100,1 - Nexperia B.V.
Specs
Device Type Buffer
Package Type SOT762-1
View Details
SOIC Interface Transceiver IC - 752-A6850KLTR-T - ERSAELECTRONICS PTE. LTD.
Specs
Device Type Transceiver
Features RoHS
Operating Temperature -40 C (-40 F)
View Details
7 suppliers