QUALCOMM, Incorporated Bluetooth Chipset QCC3003

Description
Entry-level, flash programmable audio platform for Bluetooth headsets QCC3003 Specs Bluetooth Bluetooth Version Bluetooth 5.0 Bluetooth Technology Dual-mode Bluetooth Bluetooth Profiles HFP v1.7 A2DP v1.3 AVRCPv1.5 Audio Audio Technology Qualcomm® cVc™ audio technology Digital Microphone Input 1 digital mic Channel Output Stereo DSP DSP Technology Qualcomm® Kalimba™ DSP MCU MCU Clock Speed 80MHz Memory Flash Up to 64 MB external flash Interface Supported Interfaces USB 3.0 USB 2.0 I²S SPDIF Package Package Type QFN BGA Pitch 0.4mm 0.5mm Package Size 6.0 x 6.0 x 0.6mm 5.5 x 5.5 x 1 mm
Description
Entry-level, flash programmable audio platform for Bluetooth headsets QCC3003 Specs Bluetooth Bluetooth Version Bluetooth 5.0 Bluetooth Technology Dual-mode Bluetooth Bluetooth Profiles HFP v1.7 A2DP v1.3 AVRCPv1.5 Audio Audio Technology Qualcomm® cVc™ audio technology Digital Microphone Input 1 digital mic Channel Output Stereo DSP DSP Technology Qualcomm® Kalimba™ DSP MCU MCU Clock Speed 80MHz Memory Flash Up to 64 MB external flash Interface Supported Interfaces USB 3.0 USB 2.0 I²S SPDIF Package Package Type QFN BGA Pitch 0.4mm 0.5mm Package Size 6.0 x 6.0 x 0.6mm 5.5 x 5.5 x 1 mm

Suppliers

Company
Product
Description
Supplier Links
Bluetooth Chipset - QCC3003 - QUALCOMM, Incorporated
San Diego, CA, USA
Bluetooth Chipset
QCC3003
Bluetooth Chipset QCC3003
Entry-level, flash programmable audio platform for Bluetooth headsets QCC3003 Specs Bluetooth Bluetooth Version Bluetooth 5.0 Bluetooth Technology Dual-mode Bluetooth Bluetooth Profiles HFP v1.7 A2DP v1.3 AVRCPv1.5 Audio Audio Technology Qualcomm® cVc™ audio technology Digital Microphone Input 1 digital mic Channel Output Stereo DSP DSP Technology Qualcomm® Kalimba™ DSP MCU MCU Clock Speed 80MHz Memory Flash Up to 64 MB external flash Interface Supported Interfaces USB 3.0 USB 2.0 I²S SPDIF Package Package Type QFN BGA Pitch 0.4mm 0.5mm Package Size 6.0 x 6.0 x 0.6mm 5.5 x 5.5 x 1 mm

Entry-level, flash programmable audio platform for Bluetooth headsets

QCC3003 Specs

Bluetooth

Bluetooth Version

  • Bluetooth 5.0

Bluetooth Technology

  • Dual-mode Bluetooth

Bluetooth Profiles

  • HFP v1.7
  • A2DP v1.3
  • AVRCPv1.5

Audio

Audio Technology

  • Qualcomm® cVc™ audio technology

Digital Microphone Input

  • 1 digital mic

Channel Output

  • Stereo

DSP

DSP Technology

  • Qualcomm® Kalimba™ DSP

MCU

MCU Clock Speed

  • 80MHz

Memory

Flash

  • Up to 64 MB external flash

Interface

Supported Interfaces

  • USB 3.0
  • USB 2.0
  • I²S
  • SPDIF

Package

Package Type

  • QFN
  • BGA

Pitch

  • 0.4mm
  • 0.5mm

Package Size

  • 6.0 x 6.0 x 0.6mm
  • 5.5 x 5.5 x 1 mm
Supplier's Site

Technical Specifications

  QUALCOMM, Incorporated
Product Category Network and Communication Chips
Product Number QCC3003
Product Name Bluetooth Chipset
Technology Bluetooth
Unlock Full Specs
to access all available technical data

Similar Products

RF Transceiver ICs - NRF24AP2-8CHQ32-R-ND - DigiKey
Specs
Device Type Transceiver
Interface USART
Operating Frequency 2400 MHz
View Details
Interface - Drivers, Receivers, Transceivers - 54LS245LMQB - Lingto Electronic Limited
Specs
Device Type Transceiver
View Details
RF Receivers - SI4614-A10-AM-ND - DigiKey
Skyworks Solutions, Inc.
Specs
Device Type Receiver
Operating Temperature -40 to 85 C (-40 to 185 F)
Package Type 48-VFQFN Exposed Pad
View Details
GPS Antennas - 278062 - RS Components, Ltd.
RS Components, Ltd.
Specs
Technology GPS
Features RoHS
View Details